- Team lead Mx Integration for the 7nm node responsible for coordinating process development efforts, defining integration flows and driving yield to meet technology milestones. - Special projects coordinator. Developed Globalfoundries Cobalt MOL Integration with aESL. Owned a project to reduce LER/LWR for BEOL thin wires.- Worked closely with Design and Yield Analysis groups to identify and solve yield and performance issues.

- Ownership, development and ramp of etch processes in the BEOL for 1x, 2x and 3x technology nodes- Interact closely with process and equipment owners within the etch group and externally toidentify improvement projects for throughput, process performance and cost reduction.- Works closely with Yield Enhancement and Process Integration to improve processes as wellas integration scheme with focus on Yield, Performance and Quality- Consistently ranked as a high performer by management and by peers, promoted to SMTS in2014

- Process startup at new greenfield Fab.- Plasma Etch process development, 32nm technology and below.- Position included a 1 year assignment to our factory in Dresden, Germany for process transfer, training and production support.

Plasma Etch Process Engineer - BEOLContact etch, Dual Damascene, Ultra Low-k characterization.

Responsible for developing STI, Recess and Organic layer plasma etches for Qimonda's future DRAM technology nodes including 65 nm, 46 nm and 35 nm.Industry recognized expert in Metal Recess etch, a key process in the 3D DRAM device formation.Initial setup of modules for the industry's first 4F2 DRAM cell. Processes range from STI and spacer etches to metal gate recess etch.Definition and execution of a project to evaluate different etch equipment vendors in preparation for the conversion of our production line to stacked capacitor DRAM.Process owner of fully ramped products, responsibilities include setup of statistical process control, productivity improvements and cost saving measures.Project owner for "Ultra thin films" for development of etches for dielectic spacers. Resulting processes used in all Qimonda process flows below 75 nm.