• Identify and implement technology solutions to support knowledge management initiatives• Collaborate with departments to ensure alignment between knowledge management efforts and organizational objectives.• Explore opportunities for partnership and collaboration to enhance market presence.

Conduct equity research for Taiwan upstream technology team. Sector coverage includes LCD Display, Touch panel, Foundry and IC design (Display Driver/Fingerprint Sensor) in Asia• Perform fundamental research and write company/sector reports; and assist Taiwan research head with model construction and earnings projection to formulate Buy/Sell ideas• Companies under coverage includes GIS, Chipbond and Egistec; and co-covered TSMC, UMC, SMIC, AUO, INX, and TPK with the lead analyst

Conducted interview with industry experts to update the technical and market trends• Responsibilities included offering reports to clients on a recurring basis, providing in-depth analysis and perspectives to help clients to come out investment ideas• Research coverage included the industry trend of display technologies (LCD/LED/OLED) and the competitive dynamics in the mobile industry

Business planning department – Investment Section Chief April 2010 to Jan 2011Developed and implemented strategies to secure long term orders, to increase business effectiveness, and to create synergies with the world tier partners• Compiled business plans for potential joint venture opportunities in ways of establishing LED package house, LED light bars assembly line or LED lighting fixture house

Coordinated day-to-day, near term and longer term technical projects between euro-customers and UMC interdepartmental engineers (fabs, R&D, packaging, failure analysis, and logistics); provided customers primary interface to organize necessary resource and lead projects on track •Supervised Fab engineers, collaborated with R&D engineers and oversaw cross-functional teams responsible for timely reaching each project milestone; Successfully imported 2 processes into UMC from France IDM customer, developed two customized process for Belgium and Switzerland design houses, assisted 4 euro research institutes and 5 small/mid-size companies to validate their new designs •Spearheaded and implemented solutions as yield-improving project leader; Coordinated with cross-Fab engineers to improve yield performance, facilitated the execution of innovative solutions on products, which were long suffered from defects; Yield is optimized to 99% for 20 products, which are now processed with same “porting process” from IDM customer •Consulted with clients in development process through various levels of R&D and other cross-functional advisement; Communicated recommendations among UMC cross-divisional managements and assisted the Euro first-tier IDM customer to take UMC platform for their first design-in project in 2010

Improved, implemented, and sustained diffusion processes, tools, and programs to lower costs and increase yields; Conducted root cause investigation of discrepancies by monitoring SPC, statistical process control metrics, communicating findings to cross-divisional management and resolving emergencies on the assembly line •Led yield-improving project for 0.18um flash product in nitrite deposition step. Partnered with cross-functional experts including equipment, defect, quality, and product engineers to increase process capability by 100% •Inspected and refined mechanism of wafer transferal movement, increasing speed by 120%, adopted as TSMC standard procedure •Received 3 Best Knowledge Management Awards and 2 Engineer Knowledge Management Awards for continuous innovations at TSMC •Supervised equipment engineers, sourced and secured foreign vendors to install 4 process machines, increasing production capability by 20%