Semiconductor Packaging Engineer for the Foundry Operations & Technology Business Group. Responsible for several product development processes including the ideation, design, and assembly of wafer level packaging solutions. Mechanical modeling/simulation of different semiconductor structures, components, packages, and products.

Mechanical Engineering Intern for the Fuel Equipment Design Department. Primary focus was the development of a combustion emission prediction tool through test data analysis. Additional roles included verification of piping and instrumentation diagrams (P&ID), utility boiler design drafts, and combustion calculations.

Materials Engineering Intern concentrating on alloy powder characterization. Performed research on the impact of repeatability and compression on various alloy powders, including aluminum, steel, copper, tungsten, and nickel. Plotted and analyzed research test data, focusing on discrepancies by material. Concluded research with a summary article for publication to a peer-reviewed journal.