I am the APAC Application Engineering Manager specializing in PCIe Gen5 enterprise SSDs. In my role, I oversee the application engineering functions across the Asia-Pacific region while also managing global business operations for our high-performance storage solutions.My responsibilities include leading a talented team to ensure the successful deployment and integration of PCIe Gen5 SSDs in enterprise environments. I coordinate with global stakeholders to align our technical strategies with market needs, driving product excellence and customer satisfaction across diverse regions.

I am the technical marketing engineer specializing in PCIe Gen5 enterprise SSDs. I work closely with product development teams to ensure that our SSD offerings meet the latest industry standards and exceed customer expectations. Additionally, I create technical content, manage product demonstrations, and support go-to-market strategies to effectively communicate the benefits of our SSD solutions to both technical and non-technical audiences.

PCI-E Gen5 enterprise SSD firmware FTL topic leader. Mainly response for drive reliability. e.g. program fail handling, RAID recovery, drive panic error handling depends on OCP.

PCI-E Gen5 enterprise SSD firmware leader. Mainly responsible for cross team communication, schedule management, and task division.

Work with Intel for client SSD 665p/670p. Backend task leading and assignment: NAND, DRAM, system related topic. PCI-E Gen5 enterprise SSD firmware leader. Engage the new FW/HW architecture design for next generation product.

Work with Intel for client SSD 660p/665p. Backend task leading and assignment: NAND, DRAM, system related topic.Join Intel next generation SSD product design with 96/128 layers NAND. Firmware leading and collaborate to the design win in Kingston SATA SSD OEM project. Coordinate and organize 6 engineers in my team. To guide their potential ability and reach the work goal.

Work with Intel for client SSD 540s/545s. Mainly responsible for NAND related topic: interface, error recovery, operations and FA. Trust relationship between Intel and SMI is created during these years. Join Intel next generation SSD product design with 64 layers NAND.

Flash porting, working on the 2D and 3D MLC/TLC from flash vendor, Toshiba/SanDisk, Intel/Micron, and Samsung/Hynix. USB 3.0 storage controller firmware development. 1st generation LDPC firmware development

1. Touch-panel algorithm development.2. Linux system SD card reader driver development.