James Papa Email & Phone Number

Cranston, Ri, Us

United States

Develop hardware and software for wafer sort and final package test solutions for mixed-signal and analog integrated circuit designs. Provide ATE capability and crucial real time data for New Process Development Teams for aid in the development of New Technologies. Provide New Product Development Test solutions employing schematic capture using OrCAD, Layout review in PADS and Test Programming in C++, debugging and characterizing device performance on Teradyne and Eagle 500/364 and Advantest T2K / T2KE Automated Test Equipment platforms. Perform Data Analysis and retrieval using a variety of Data analysis tools including Excensio, Data Power and Dana among others.

Smithfield, Rhode Island

Develop test solutions and new design verification and validation for sophisticated high efficiency PMIC and Mixed Signal Power Management IC controllers and high density point of load System in Package platforms. Controllers include multiple buck and boost power converters in wafer and packaged form. Full analog and digital testing utilizing SPI and I2C communication protocol is developed on Teradyne MicroFLEX Test Systems utilizing product specific hardware and software designs.

North Smithfield, Ri

Develop test solutions and new design verification and validation for sophisticated high efficiency Mixed Signal Power Management IC controllers and high density point of load System in Package platforms. Controllers include buck and boost power converters in wafer and packaged form. Full analog and digital testing utilizing I2C communication protocol is developed on C++ based Eagle ETS 300 Test Systems utilizing product specific hardware and software designs.

Integrated Circuit Design of Automotive Power Management products in BCDMOS and Bipolar processes including: DC-DC Current Mode Non-Synchronous Boost Controllers and 2MHz Buck Switching Regulators; Linear Regulators; H Bridge Motor Driver; Post package I2C programmable functions / trim utilization; Functioned as Lead and Team Designer in the Switcher Group.

Develop hardware and software for wafer sort and final package test solutions for mixed-signal and analog integrated circuit designs. Test solutions employed schematic capture using OrCAD and Test Programming in C++, debugging and characterizing device performance on Teradyne and Eagle 500/364 Automated Test Equipment platforms.

Worcester Massachusetts

Worked in the Standard Products section of the Product Engineering Manufacturing group. Main duties and responsibilities included monitoring device yields, tracing failure modes to lot parameters, developing new test software, improving existing test software, providing feedback to Fab department to resolve processing problems, performing device characterization, compiling and presenting data reports, and generating and maintaining device and factory flow documentation.

Worcester, Massachusetts

Responsible for the development of custom hybrid IC circuits. Primary focus was prototypes,laser trimming and troubleshooting thick film hybrid circuits.

Master Of Science, Electrical Engineering

Bachelor Of Science (B.S.), Electrical And Electronics Engineering

Education record