-Managing Infrastructure Team including AI&GP server, switch, LEO, 5G for worldwide OEMs/ODMs- Planning next-gen products with end customers for time to market-Analyzing target available market ,making annual strategies ,and executing plan

- To design-in materials in 5G relative ODMs in Taiwan (server, Ethernet switch, small cell...)- To analyze the market trend of infrastructure market.- To carry out strategies of company's target.- Be a coordinator for severing ODMs and PCBs to engage new materials.- To deliver customer's material demand to R&D for developing competitive ones and time to market.

- Main customers are OEMs/ODMs/PCBs - Products include automotive ,telecom ,and data center (server, Ethernet switch, small cell)- Technical support for new materials- To promote new materials

- Process engineering of image transfer & etching- New material evaluation including : high speed material / dry film/ soldermask...- New products development and customer consultant- Integration process and pre-engineering and reliability- LED substrate project coordinator- Cost saving & Yield improvement - Process trouble shooting

- New product development (including material, process, design..) Semi-flex / Cavity board/ Heavy-copper /High layer count / Rigid-Flex- N+N stack-up product yield improvement- HDI registration - Electrical impedance improvement