Design and develop products in QFN, FCCSP, and BGA packages. Interact with internal design, NPI, and sales teams to ensure the requirements for performance, quality, cost and on time delivery of products was met. Lead contact with international assembly sites for package related items. Performed thermal and structural analysis of packages as needed using ANSYS and FloTherm.

Work with cross functional teams to develop various packages, including QFN, FCCSP, BGA, metal-ceramic, and others, in support of product units. Interact with domestic and international sub cons for design and assembly of products. Performed thermal and structural analysis of packages as needed using ANSYS.

Provide consultation for a broad range of semiconductor packaging. Perform thermal and structural finite element analysis to evaluate current designs and proposed changes. Propose package designs, changes, and materials to reduce cost, improve performance, and make products more manufacturable. Give guidance with assembly processes and potential locations.

Work with technical, sales, program management, and operations teams to plan, coordinate, and execute development of finger print sensor products. Drive execution of programs to meet performance, cost, and schedule targets as well as customer requirements. Implemented online system to create and track issues and deliverables for various engineering teams in the division. Work with engineering and operations teams to identify, qualify and track worldwide assembly subcontractors. Report directly to Senior Director on status and issues for all programs within the division

Headed team of design engineers in development of LCP (liquid crystal polymers) air cavity packaging. Lead NPI activities for multiple programs across various product lines. Primary liaison for numerous customers for both technical and sales activities. Drove technical innovation/development for improved performance and reduced cost.

Led thermal and mechanical design activities for packaging of new semiconductor device technology. Redesigned package structure resulting in products with improved thermal performance, mechanical reliability and manufacturing yield. Package improvements allowed for expanded product market application and increased sales. Utilized finite element thermal and mechanical analysis to drive new die design concepts.

Senior electronics packaging engineer in charge of new product development, materials research and development, vendor and assembly site interaction and reliability testing. Championed numerous package development projects for higher performance, lower cost, and improved assembly yield.

Supported multiple internal and external customers with various aspects of package development and analysis via thermal and mechanical FEA. Coordinated measurement activities for model validations. Numerous package platforms evaluated including high and low power, plastic and metal-ceramic RF package, CATV, and power modules.

Chosen as the sole participant in developmental program to be trained in thermal and mechanical FEA. Mentored by experienced senior engineers in research center while providing support to product groups with simulation as well as hand on work related to packaging. Internal classes and ASU coursework taken.

Gained experience and knowledge via four, three month rotations: Opto-isolator package benchmark and redesign for performance and cost improvements; Manufacturing process development for robotic solder arm; Failure analysis techniques; and power plastic package development.