basic and practical knowledge in the areas: semiconductor technology, surface science, micro and nano technology, vacuum technology, materials science, thin film analytics, plasma technologies R&D project management: application, execution, fulfillment of milestones and project aims, care for cooperation contacts, reporting, documentationexperience in production environments & research: clean room, international team workstartup and keeping process equipment availableprocess development and optimization, process documentationareas of expertise: - thin film deposition: semiconductor epitaxy (MOCVD), PVD (evaporation, ion beam sputtering)- surface engineering: ion beam figuring (IBF), reactive ion beam etching (RIBE)- semiconductor processing technologies: thermal crystallization, ICP-dry etching- material characterization techniques: optical spectroscopy (PL, PLE, EL, PC), structural sample analysis (XRD, SIMS, TEM evaluation), topography measurements (AFM, SEM, interferometry)- DP-skills (MS, linux, programming, scientific software), english (technical and conversation)
Listed skills include Sputtering, Charakterisierung, Materialwissenschaft Und Werkstofftechnik, Rasterkraftmikroskop, and 30 others.