I am an RF Engineer and have worked for a few companies including component manufacturers and Satellite systems suppliers.Involved in projects with multi-disciplined Engineers to deliver production ready semiconductor device solutions. Interfacing with subcontract build suppliers and internal reliability teams to ensure reliability, build and test yields are achieved.Working on a range of designs including power amplifiers, switches, limiters, phase shifters, attenuators, mixers, up converters, all as individual components or combinded in a larger system. Using a mix of technologies including GaN, InGaP HBT, GaAs HFET and GaAs Low Noise FET and assembly techniques including Thermo-sonic Gold wire bonding, Epoxy/Eutectic die attach. Making use of a range of packaging technologies such as Ceramic, Laminate and plastic lead frame as well as bare die direct on PCB. Working on a range of power levels up to 450Watt and frequencies up to 78Ghz. Extensive knowledge of PCB and assembly techniques in the R&D and mass manufacture environment. Able to place components and rework devices down to die level and ability to hand place die thicknesses down to 2mil thick and components down to 01005 size. Manual and automated Thermo-sonic Gold wire bonding experience as well as knowledge subcontract manufacturer capability.Circuit design using a range of techniques including EM simulation with Keysight ADS, Microwave Office, Altium Designer and on bench tuning/optimising. Diagnose product integration issues in customer solution environment which can include oscillation, thermal or processing issues. This includes optimisation of solder and PCB layout for best possible device performance.Also have been involved in the development of Automotive radar for Autonomous vehicle, adaptive cruise control and collision avoidance systems. Involves the integration of devices at 77GHz while avoiding oscillations, interference between transmit and receive sections and interference between different receive signals in the same sections.