Jan Kellar Email & Phone Number

Tempe, Arizona

Manage the creation of the company-wide design methodologies for semiconductor to printed circuit board interconnects.Collaborate with Electronic Design Automation (EDA) suppliers and Spansion engineers to streamline and integrate design and simulation tools, design flows and methodologies to improve overall system level design. Organize workshops, training, pilot program management.

Global Design Manager responsible for all aspects of IC package design, thermal, mechancial and signal integrity.Supported all package types (leadframes, BGA, HDI, RF Modules) and all business groups (Networking, Automotive, Wireless, RF, Sensors). Responsible for design for manufacturability and substrate cost. In depth knowledge of design rules, substrate fabrication and assembly processes related to packaging.

Managed product package designers and software engineers. Promoted teamwork and accountability to maximize productivity and quality performance with attention to customer service.

Responsible for all aspects of advanced packaging physical design. Design experience includes complex Multi-Chip Modules (MCM) with controllers, ASICs and memory devices; flip chip chip-scale packages; ball grid array packages and test boards.