Joao Marques
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Joao Marques Email & Phone Number

R and D Engineer for System-Packaging, 3D-Thermoforming and PCB Technologies at Fraunhofer IZM Berlin
Location: Berlin Metropolitan Area, Germany, Germany 4 work roles 1 school
1 work email found @izm.fraunhofer.de LinkedIn matched
✓ Verified Jun 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email j****@izm.fraunhofer.de
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Current company
Fraunhofer IZM Berlin
Role
R and D Engineer for System-Packaging, 3D-Thermoforming and PCB Technologies
Location
Berlin Metropolitan Area, Germany, Germany
Company size
318 employees

Who is Joao Marques? Overview

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Quick answer

Joao Marques is listed as R and D Engineer for System-Packaging, 3D-Thermoforming and PCB Technologies at Fraunhofer IZM Berlin, a company with 318 employees, based in Berlin Metropolitan Area, Germany, Germany. AeroLeads shows a work email signal at izm.fraunhofer.de and a matched LinkedIn profile for Joao Marques.

Joao Marques previously worked as R&D Engineer for System-Packaging, 3D-Thermoforming and PCB Technologies at Fraunhofer Izm Berlin and Diplomate and Student Trainee at Fraunhofer Izm Berlin. Joao Marques holds Dipl.-Ing. (Fh), Micro System Technologies from Hochschule Für Technik Und Wirtschaft Berlin.

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Email format at Fraunhofer IZM Berlin

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{first}.{last}@izm.fraunhofer.de
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Profile bio

About Joao Marques

Joao Marques is a R and D Engineer for System-Packaging, 3D-Thermoforming and PCB Technologies at Fraunhofer IZM Berlin. He possess expertise in research and development, pcb design, integrated circuits, packaging engineering, thermoforming. He is proficient in Portuguese and English.

Listed skills include Research And Development, Pcb Design, Integrated Circuits, Packaging Engineering, and 1 others.

Current workplace

Joao Marques's current company

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Fraunhofer IZM Berlin
Fraunhofer Izm Berlin
R and D Engineer for System-Packaging, 3D-Thermoforming and PCB Technologies
Berlin, DE
Website
fhg.de
Employees
318
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4 roles

Joao Marques work experience

A career timeline built from the work history available for this profile.

R And D Engineer For System-Packaging, 3D-Thermoforming And Pcb Technologies

Fraunhofer Izm Berlin

Berlin, DE

R&D Engineer For System-Packaging, 3D-Thermoforming And Pcb Technologies

Current
Fraunhofer Izm Berlin

13355

current microsystem technology research/work/skills:- conducting R&D and prototype conversion of thermoformed/shapeable printed circuit boards (PCBs)- 3D-formed PCBs with properties down to 50 µm line/space and 75 µm vias - Research with (transparent) thermoplastic material as PCB carrier (polycarbonate PC, polymethylmethacrylate PMMA, Polyethylene.

Oct 2009 - Present

Diplomate And Student Trainee

Fraunhofer Izm Berlin

13355

Diploma Thesis: Technology Development for Elevated High-Frequency Antenna (microstrip antenna) using Tools and Processes of Printed Circuit Board FabricationAcquired skills during the graduation period: Computer-aided PCB-design, Multilayer Substrate Vacuum Lamination, Laserbeam Cutting/Drilling, Laser Direct Structuring, Copper Electroplating, Wet.

Mar 2009 - Sep 2009

Student Research Assistant

Hymite

- supporting the engineer-staff in their work - handling of micromachinig equipment - optical inspection of microelectronic components- electric measurement of ICs and assembly groups- manual chipbonding- using soldering processes with lead free solder- adhesion- and shear-strength tests- metallography (cross-section)

Apr 2007 - Jan 2009
Team & coworkers

Colleagues at Fraunhofer IZM Berlin

Other employees you can reach at fhg.de. View company contacts for 318 employees →

MM Max M. Max M. Colleague at Fraunhofer Izm BerlinBerlin Metropolitan Area, Germany View → ŞM Şükrücan Mutlu Şükrücan Mutlu Colleague at Fraunhofer Izm BerlinBerlin, Berlin, Germany, Germany View → AK Andreas Kieninger Andreas Kieninger Colleague at Fraunhofer Izm BerlinBerlin, Berlin, Germany, Germany View → SA Stefan Ast Stefan Ast Colleague at Fraunhofer Izm BerlinBerlin, Berlin, Germany, Germany View → LB Lars Böttcher Lars Böttcher Colleague at Fraunhofer Izm BerlinBerlin Metropolitan Area, Germany View → PA Phillip Arnold Phillip Arnold Colleague at Fraunhofer Izm BerlinGermany, Germany View → ME Mounib Elakoum Mounib Elakoum Colleague at Fraunhofer Izm BerlinBerlin Metropolitan Area, Germany View → KK Kevin Kröhnert Kevin Kröhnert Colleague at Fraunhofer Izm BerlinBerlin, Berlin, Germany, Germany View → AA Andische Azad Andische Azad Colleague at Fraunhofer Izm BerlinMagdeburg, Saxony-Anhalt, Germany, Germany View → MM Marius Müller Marius Müller Colleague at Fraunhofer Izm BerlinBerlin, Berlin, Germany, Germany View →
1 education record

Joao Marques education

FAQ

Frequently asked questions about Joao Marques

Quick answers generated from the profile data available on this page.

What company does Joao Marques work for?

Joao Marques works for Fraunhofer IZM Berlin.

What is Joao Marques's role at Fraunhofer IZM Berlin?

Joao Marques is listed as R and D Engineer for System-Packaging, 3D-Thermoforming and PCB Technologies at Fraunhofer IZM Berlin.

What is Joao Marques's email address?

AeroLeads has found 1 work email signal at @izm.fraunhofer.de for Joao Marques at Fraunhofer IZM Berlin.

Where is Joao Marques based?

Joao Marques is based in Berlin Metropolitan Area, Germany, Germany while working with Fraunhofer IZM Berlin.

What companies has Joao Marques worked for?

Joao Marques has worked for Fraunhofer Izm Berlin and Hymite.

Who are Joao Marques's colleagues at Fraunhofer IZM Berlin?

Joao Marques's colleagues at Fraunhofer IZM Berlin include Max M., Şükrücan Mutlu, Andreas Kieninger, Stefan Ast, and Lars Böttcher.

How can I contact Joao Marques?

You can use AeroLeads to view verified contact signals for Joao Marques at Fraunhofer IZM Berlin, including work email, phone, and LinkedIn data when available.

What schools did Joao Marques attend?

Joao Marques holds Dipl.-Ing. (Fh), Micro System Technologies from Hochschule Für Technik Und Wirtschaft Berlin.

What skills is Joao Marques known for?

Joao Marques is listed with skills including Research And Development, Pcb Design, Integrated Circuits, Packaging Engineering, and Thermoforming.

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