Johan Knol Email & Phone Number

Our lab is a state-of-the-art Silicon Debug lab that supports new product introductions for all NXP product design groups, covering mixed signal process technologies down to the 16nm node and beyond. We have an ever expanding cutting edge tool set: Laser Voltage Probing (LVP), Electro-Optical Frequency Mapping (EOFM) Atomic Force Microscopy assisted Multiprobe, Industrial Testers, Time Resolved Photon Emission Microscopy (TRE) and more for electrical localization as well as the latest generation Scanning Electron Microscopes (SEM), Focused Ion Beams (FIB) for advanced backside modifications and Transmission Electron Microscopes (TEM) for physical analysis to name just a few. In addition to the Failure Analysis team, the Material Analysis team is absolutely key in addressing complex lifespan interactions between chip packages and the chip itself in relation to the entire manufacturing chain, nailing it down to parts-per-billion levels.Our work spans across IC architecture, mixed signal design, software tools in relation to logic scan-based and bitmap methodologies, device physics, front end process engineering and IC reliability failure mechanisms.My team consists of high educated and strong driven engineers with a focus on delivering on commitment while providing world class service to the design or quality teams. It is an international team combining hundreds of years of experience from all corners of the semiconductor field. I nourish diversity of thoughts and the individual well being. My mission therefore is to provide the team a challenging and engaged atmosphere, ownership and expanding horizons through interactions with the whole of NXP. All of this with breathing spaces for innovation, relationships and a strong mindset for competence development programs.

Listed skills include Semiconductors, Cmos, Management, Problem Solving, and 5 others.

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  Technical University Of Twente

  Electronics