Short term contract at Bose Corporation.

• As a member of the HPC “super-computer” design team, provided Component Engineeringoversight of all electronic components at the PC board level.• During product’s initial design phase, reviewed all new component requests.Identified suitable existing Intel part numbers or generated new ones. Identified second sources.Set up new parts in SPEED-SAP database listing important characteristics and approved manufacturers’ part numbers. Archived and indexed component datasheets. • During product’s prototype evaluation phase, managed the collection of RoHS declarations andthe archiving of declarations into the corporate ecology database. Subscribed to ACO change notifications in SPEED for all components. Analyzed the potential impact of ACO changes,including those initiated by users outside of my business unit. Authored the change orders andqualification documents needed to upgrade a component’s status from engineering status toproduction status. Presented a weekly progress report to management and the design team.• During product’s full production, solved component issues (shortages, etc.) as requested bythe contract manufacturer or the Intel Manufacturing Engineer.

• As a member of the Corporate Quality Department, evaluated and classified a wide varietyof electronic components. Identified components that were preferred for new designs.• Resolved quality issues reported by Lutron’s ISO 9001 electronics manufacturing facilities in Pennsylvania and Puerto Rico.• Worked with suppliers and outside failure-analysis labs to determine root-causes of component-related failures as well as cosmetic defects of plastic faceplates.• Issued corrective action and preventative action bulletins to internal departments. • Solved Procurement Dept. problems by finding acceptable replacements for parts that were temporarily unavailable or obsolete or pending EOL (End of Life). Saved $30,000 in PC board inventory and re-design costs in one instance. Supported cost reduction efforts.• Led a quality improvement team that developed a system of tracking supplier PCNs(Product Change Notices). • Reviewed and approved procurement specifications (as well as other documentationsuch as assembly visual aids, special run memos, product label text, product test manuals,and end-user guides).• Completed Lutron’s training for Lean Manufacturing, SPC, 8D, and Internal Auditor.• Led qualification of new RoHS-compliant components as the Component Leader of thePb-Free / RoHS Team. Authored corporate guideline outlining selection of components and solderto meet RoHS (Restrictions of Hazardous Substances).• Organized and implemented an in-house quality training program integrating courses from Lutron and the American Society for Quality (ASQ). Results: 100% of students that sat for CQIA exam passed and were certified by ASQ.

• Functioned as in-factory expert for resolving all component problems in Procurement, Incoming QA, Manufacturing, and Test areas in Ohio ISO 9001 electronics manufacturing facility.• Provided technical assistance to circuit designers regarding selection of resistors, capacitors,crystals, inductors, diodes, transistors, integrated circuits, connectors, relays, and switches.• Developed and documented component test requirements and burn-in plans. • Solved Purchasing Department problems by finding substitutes for components that were unavailable.• Originated and processed Engineering Change Orders for components and assemblies.• Performed technical writing of Engineering Methods & Procedures.• Traveled to Schindler’s facilities in Switzerland to implement Global Printed Circuit projectand to coordinate the migration of component and product data into SAP.