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Experienced Application, Process Development, and Service Engineer with a demonstrated history of working in the semiconductor & microelectronics industry. Result-driven individual successful in: working cross-functionally with many departments & individually “wearing multiple hats” to complete the task at hand & other projects running simultaneously using hands-on, time management, and critical thinking skills, completing FEOL & BEOL customer demos according to detailed parameters & specifications at both wafer level and die level stages using my general knowledge from experience & Six Sigma methods and techniques i.e. DOE, 5S, DMAIC, Kaizen, Root Cause Analysis, etc., assisting the design & development of customized capital equipment with the use of software such as Solidworks and AutoCAD, the installation, training, upgrading, & preventative maintenance of capital equipment, investigating and solving root cause problems, overseeing & mentoring less experienced engineers in all aspects from equipment upkeep (knowledge to safely run equipment, PM, upgrades, etc.) and processing (pre-process inspections, processing of live products, process development, post-process metrology, scientific report writing, presenting results to customers, etc.) to general lab & cleanroom procedures (maintaining safety, cleanliness, quality, 5S, continuous improvement, etc.), and also customer facing roles & responsibilities to demonstrate the continued growth & development of equipment technology that provides advancements to optimize PORs, increase throughput, efficiency, quality, and the use of new materials with enhanced physical properties to advance technology according to customer specifications, industry standards, and MIL-STDs. Skilled in Critical Thinking, Problem Solving, Class 100 Clean Room Procedures, Six Sigma, 5S, Hazardous Chemicals, Hazardous Waste, HAZWOPER Training, Research and Development (R&D), Semiconductor Applications (i.e Photoresist/Dry Resist Removal, Metal/Material Liftoff, Wet Etching, Silicon Thinning, UBM, RDL, Lie/Space, Compound Semiconductors, Power Electronics, 2.5D/3D Packaging, Thin Films, Ownership of Capital Equipment, PCB & Microelectronic Manufacturing, Wire & Die Bonding Equipment & Applications, Process Development & Optimization, Electroplating, the Operation, Understanding, & Maintenance of Metrology Equipment, etc. Self-motivated, strong engineering professional, graduated from Albright College (Reading, PA) & Roman Catholic High School (Philadelphia, PA), looking to help develop new technology with an innovative company. .
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Ai Evaluation SpecialistOutlierPhiladelphia, Pa, Us
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Process EngineerTeledyne Judson Technologies, Llc Jun 2022 - PresentMontgomeryville, Pennsylvania, United States -
Service EngineerCwi Technical Sales Mar 2021 - Oct 2021Morganville, New Jersey -
Process Engineer B (Microelectronics)Ar Rf/Microwave Instrumentation Nov 2019 - Feb 2020Souderton, Pennsylvania- Responsible for providing technical guidance to engineering and production for the design and manufacturing of broadband and RF amplifiers in order to take designs from development to production by applying the latest manufacturing practices and resolving issues from equipment, tooling, procedures, materials, etc. - Evaluating and implementing alternative methods and techniques to improve labor efficiency while leading the development of complex mechanical designs of housings, carriers, flanges, heat sinks, and hybrid packages as well as production and microelectronic assembly fixturing. - Responsible for overseeing the Microelectronics Technology (MET) Labs clean room processing and packaging of high frequency power amplifiers based on thin film and thick film substrates with open die fabrication.Tasks and duties including but not limited to equipment set-up in order to achieve required wire-bonding loop height and bond pull strength requiring intimate knowledge of ultrasonic and thermo-compression wire-bonding processes and techniques, equipment set-up to achieve consistent, reliable die bonding processes dependant on the processes, techniques, and materials including eutectic, epoxy, and sintering.- Solely responsible for the coordination of the installation, training, and processing of prototype printed circuit boards (PCBs) using LPKF milling machine ProtoMat S104 and laser removal machine ProtoLaser ST. - Major role in the research and development of future designs, materials, processes, and techniques that will be utilized to increase product performance, efficiency, and reliability which must first be tested and confirmed, optimized, and then implemented into production -
Process EngineerR&D Altanova Apr 2019 - Jun 2019South Plainfield, New Jersey- Responsible for monitoring and improving existing manufacturing processes for all electroplating related operations in the production of printed circuit boards (PCB) by identifying issues and proposing corrective actions and respective implementation while expressing a good problem solving capability. - Establishing production standards and throughput capacities for planning and scheduling needs while monitoring and improving production yields in accordance with manufacturing goals. - Overseeing, supervising, and training operators to understand the entire process and follow procedures in order to maintain consistent process results and continuous production while following and complying with all OSHA, ISO 9001, and company safety procedures. - Developing and managing independent projects to optimize and create new processes with documentation and consistent monitoring that lead to improved results, better customer products, and process cost reduction. -
Senior Process Development EngineerVeeco Precision Surface Processing May 2011 - May 2018Horsham, Pa- Responsible for the development, implementation, and optimization of single wafer wet processes for incoming semiconductor customer samples according to the needs and requests of the customer in order to achieve the production goals of the company. - Work closely with the customer either hosting them on site for the demo or contacting remotely in order to demonstrate our equipments capabilities and/or to communicate before/during/after processing to ensure proper and successful results. - Perform any maintenance (plumbing, electrical, mechanical) or troubleshooting (operational, software, firmware) required on our single wafer processing equipment to ensure proper system performance. Most common applications include silicon/metal/TSV/insulator/dielectric etching, photoresist/dry film striping, cleaning down to <60nm, photoresist/flux spin coating and reflow. - Extensive knowledge and use of metrology including: Scanning Electron Microscope (SEM) [Hitachi S-3700 & SU- 5000] with Energy-Dispersive X-Ray Spectroscopy (EDS), Atomic Force Microscope (AFM), Sentronics SemDex (Infrared Wafer Thickness Measurement), SP-1 & SP-2 Surf Scan, TLA-Tencor Candella Surf Scan, Quadmap 4 point probe, F-60 Filmetrics Ellipsometer, P-16 Profilometer, Lattice Axe, Hitachi Ion Mill 4000, Hummer Sputtering System, Olympus LEXT Laser Microscope (with stage control), Olympus Manual Optical Microscope, an Olympus fully automated Optical Microscope with Olympus Wafer Navigation (OWN) software and a Zeiss Confocal Laser Scanning Microscope. -
Hazardous Waste ManagerVeeco Precision Surface Processing Mar 2014 - May 2016Horsham, PaOverseeing the accumulation, storage, transportation, and disposal of hazardous chemicals from spent semiconductor processes of a Large Quantity Generator. Maintaining the facilities compliance at all times according to EPA standards which includes but is not limited to hazardous waste manifests, weekly inspections, air emissions permits, annual source reduction strategies, and biennial reports for random EPA inspections.
John Clark Skills
John Clark Education Details
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>3.0 Chemistry Gpa -
4.0 Gpa
Frequently Asked Questions about John Clark
What company does John Clark work for?
John Clark works for Outlier
What is John Clark's role at the current company?
John Clark's current role is AI Evaluation Specialist.
What is John Clark's email address?
John Clark's email address is jc****@****eco.com
What is John Clark's direct phone number?
John Clark's direct phone number is +121542*****
What schools did John Clark attend?
John Clark attended Albright College, Roman Catholic High School.
What skills is John Clark known for?
John Clark has skills like Semiconductors, Semiconductor Industry, Manufacturing, Process Engineering, Six Sigma, Cross Functional Team Leadership, Process Improvement, Metrology, Scanning Electron Microscopy, Hazardous Waste Management, R&d, Product Development.
Who are John Clark's colleagues?
John Clark's colleagues are Hayley Snelling, Suchithra Ravikumar, Samantha Neibloom, Bryanna Pado, Courtney Shaw, Carlo Juden Sarmiento, Matthew Shaw.
Not the John Clark you were looking for?
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John Clark
Interim Cfo, Coo | Advisor To Ai-Driven Businesses | Strategic Value Creation I FundingSan Francisco Bay Area1techspringpartners.com -
John Clark
Palmdale, Ca -
John Clark
Los Angeles, Ca5nd.edu, aol.com, yahoo.com, alumni.nd.edu, aresmgmt.com6 +197232XXXXX
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2gmail.com, tk.co3 +130133XXXXX
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John Clark
San Francisco Bay Area2valtix.com, thousandeyes.com7 +193198XXXXX
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