John Jacobi Email & Phone Number

San Francisco Bay Area

> Identified and managed constraints to achieve the business strategy. Successfully developed, scaled up, and launched a new technology haptic actuator, then facilitated the sale and transition of Novasentis to a leading global electronics company.> Identified and enrolled development and manufacturing partners, coordinated product and process development in US and Europe, scaled-up manufacturing, drove completion of Rev A production prototype product and processes.> Hired and coached Engineering teams, managed remote sites, led operations in R&D, Manufacturing, Materials management, Quality Management and Operations Finance.

> Created and directed a Manufacturing Development organization responsible for developing, installing and validating production processes and equipment, and in so doing achieved breakthroughs for meeting or beating schedule, quality, cost, and operational objectives for all new energy-based products.> Defined and implemented a manufacturing technology strategy that enabled aggressive continuous improvement and global transportability, collaboration and management.

> Worked with medical device and commercial customers, from corporate clients to start-up organizations, helping to grow our contract manufacturing business to $80M; thus helping to prove that it is very possible to manufacture in the USA, make a profit, grow the business, and have happy customers.

> Co-managed an Executive-level alliance regarding CPU product roadmaps, development, and supply. Worked with executives and corporate legal to draft, negotiate and close executive level agreements. > Created a New Business Development process for HP’s largest R&D Lab.

> Led joint manufacturing development operations in a start-up alliance relationship that produced the world’s first production Liquid-Crystal-on-Silicon microdisplay. > Established internal/external and low/high volume manufacturing strategies and formed successful strategic supplier relationships.

> Co-developed and championed best practice local and global supplier management strategies. Developed an organization to execute those strategies and deliver a best-in-class value proposition.> Tripled the number of microelectronic product lines by driving qualification and production release of leading edge technologies. Earned a reputation as a technology, quality, and cost leader in integrated circuit packaging. > Realized breakthroughs in customer satisfaction for technology, quality (100X), and responsiveness while reducing the departmental cost structure by 50 percent.

Developed and released new first-level chip packaging technologies for leading edge computer systems. Received Patent No. 4,842,662 for a high-density, low cost chip interconnect technology.

Achieved industry firsts in computer modeling, field testing and model testing of ship/ice dynamics and large scale transportation systems.

M. Eng., Mechanical And Aerospace Engineering

B.S. Engineering, Naval Architecture And Marine Engineering