John L. Email & Phone Number

Taiwan

Work in a UK/German based fabless company, the main supplier of system Power Management IC for Apple Inc's iPhone/iPad. Partner closely with outsourced manufacturing subcontractors and focus on technical process issue in assembly. First point of contact person for major issues and lead cross-functional communication with internal teams and external ODMs/Vendors/customers during New Product Introduction (NPI) phase. • Develop project schedule, milestone and budget plan base on the business units' roadmap and customer expectation. Translate customer requirements and project goal into specific tasks.• Actively track and drive all tasks to closure. Communicate result to higher management.• Identify risks/issues/critical path early in the NPI phase and drive to resolution prior to ramp. • Review technical manufacture process/data. Understand SPC and process control. • Standardize operating procedure and enhance efficiency. Continuously review to make process streamlined to improve its effectiveness.• Work with multi-national functional units (Marketing, Planning, Product, Testing, Sustaining teams), communicate and resolve issue even in different geographical/time zones. • Involved in TSMC GaN product development project.

Taiwan

Employed by a fast-growing LCD display driver IC and Touch-Screen solution provider. Responsible for system planning and technical design for Touch Screen IC. • Led engineering validation team for Touch-Screen IC prior production.• Analyzed noise budge for Touch panel sensing system.• Co-worked with panel supplier for capacitive sensor design trade-offs performance/cost.• Bandgap voltage reference – Lead +/-3σprocess tolerant design with trimming/test-mode scheme. Performed non-ideal parameter, device offset and noise analysis.• High-Voltage flying capacitor charge-pump boost circuit.• Improved Touch IC Analog-Front-End, amplifier circuits and High-Voltage IO circuit. • Capacitive Stylus – Driving stylus product plan, signal process and algorithm architecture.

Taiwan

Project leader for Digital Radio (DAB) Baseband. Managed project schedule. Negotiated and resolved conflicts for limited resource in a start-up company.• Conducted chip planning – Estimate on cost and system budget. System derived in Matlab behavioral modeling; package selection and simulation; package pin definition; ESD and power/ground planning; digital/analog block merge; dummy density violation rule fixed-up, mask job deck view; Evaluation PCB floor-plan; product test plan etc.• Designed a hundred MHz ADC (Analog-to-Digital Converter) for multi-standards with cap-less LDO regulators. Designed an Audio DAC (Digital-to-Analog Converters) with embedded earphone power amplifier driver and digital volume control.

Taiwan

Employed in a WIFI IC company providing solutions for routers and notebooks/dongles . Responsible for Baseband IC design and technical writing. Specialized in high resolution ADC/ DAC and worked closely with RFIC and baseband teams.• 11-bit Continuous-Time ΣΔADC – Designed Ralink’s first Sigma-Delta ADC for Bluetooth application. • 5-bit Continuous-Time ΣΔ ADC – Designed for Signal Strength Indicator.• Temperature sensing and signal strength indication – Designed a 12-bit Switched-Capacitor type ΣΔ ADC and Front-end circuitry.• LDO regulator – Designed 3.3v/1.5v regulated to 1.2v with >1A for digital circuitry.

Taiwan

Belonged to Mixed-Mode IP (Intellectual Property) design department and provide license-free IP for customer interests in UMC foundry process. Designed Analog (spectre/hspice) and Digital (RTL) circuits for Audio DAC and ADC. Developed roadmaps for Audio IPs.• 16-bit audio ΣΔ DAC – Designed a low-power audio DAC using asymmetric PWM with 1.5-bit DAC and Analog filter for reduce analog area and power consumption. Familiar with Audio Precision and strong understanding in application. Translate specification to test items. Travelled to Japan for design review. • Temperature Sensor – Communicated with potential customers for merge IP into production design.• 45nm 3-bit ADC – Designed Flash ADC for process monitoring on wafer.

Executive Master Of Business Administration (Emba), Business Administration And Management, General, Gpa: 3.41

National Taiwan University (Taipei, Taiwan) and Fudan University ( Shanghai, China) joint program Thesis: A Case-Based Study.

Executive Master Of Business Administration (Emba), Business Administration And Management, General, Gpa: 3.41

National Taiwan University (Taipei, Taiwan) and Fudan University ( Shanghai, China) joint program Thesis: A Case-Based Study.

Master Of Engineering Science, Electrical Engineering

Focus: Analog IC Design, Mixed-signals, DSP, MEMS and Finite Element Applications, RF electronic communication systems, Microelectronics.

Bachelor Of Engineering (B.E.), Mechatronics, Honors

Focus: Electronics, Electrical Engineering, Microprocessor, Artificial Intelligent, Control Engineering, Optical signal processing.

Education record