Technical Lead, Microelectronics Design, Test, and Reliability Branch, 5/15 to Present • Responsible for all Device Reliability and Test team activities, technical reports, and communications in support of both internal and external workload • Characterize device reliability through accelerated stress test studying failure mechanism including: Electromigration, Time-Dependent Dielectric Breakdown, Hot-Carrier Injection, and Bias Temperature Instability• Provide engineering teams with operational leadership in planning for budget, training, conferences, and career growth • Provide resource, and laboratory equipment management based on project priority Installation and Qualification Strategy Team• Work as part of a small cross-divisional team to analyze industry and military standards, lessons learned, and partner foundry best practices to optimized the organizational approach to foundry technology acquisition, installation, qualification, and readiness• Support the organization with development of position descriptions, hiring, outreach and recruitmentProcess Integration Engineer, 1/08 to 5/15Process Integration • Led cross-functional engineering efforts to achieve the successful integration of a foundry process technologyFoundry Production Engineer, 1/07 to 1/08• Served as the Metrology functional area process engineering lead

Packaging and Assembly Intern• Learned and performed single chip microcircuit assembly processes Foundry Intern• Obtained certification on tools required to manufacture capacitance vs. voltage (CV) test structures, and to perform CV testing• Interpreted and reported the results of CV plots as applicable to contamination levels in diffusion furnaces