Development Engineer
Multiplex Incorporated
Developed optical repeater CPCi rackmount system. Designed all parts and assemblies in Pro/E; including heatsinks, faceplates, PCB outlines, EMI shields and backplane connector system. Responsible for mechanical layout, thermal management of the rackmount system, optical tray and repeater cards. Coordinated all efforts for procurement, production, quality control, reliability and environmental testing of the system.Responsible for transponder product line mechanical development; 10 gigabit 300-pin transponders included: flat-top, heat-fin and small-form factor designs. Design components included housings, PCB outlines, EMI shields, inter-connectors and conforming materials.Coordinated outsourcing for PCB assemblies. Responsible for qualifying all PCB assembly vendors. Organized consigned materials, design specifications and quality requirements.Designed and built fixtures for soldering, desoldering, assembly and test, for transponder product line. Responsible for maintaining, programming and training technicians on in-house equipment such as the BGA rework station, convection oven, screen printer and machine shop tools. Worked with managers, engineers and technicians to optimize process flow documentation.Supported manufacturing and production for transponders, lasers (EML's) and receivers departments. Responsible for documenting, fixturing, machining and failure mode analysis on the following processes: SMA and TH soldering, laser welding, die attach, wire bonding and seam sealing.Was key contributor to Multiplex ISO 9001 certification. Finalized transponder, laser and receiver documents throughout manufacturing process. Drafted part and assembly drawings, procedures, bills of materials, travelers, process flow charts and engineering changes orders for document control.