June C. Email & Phone Number

Expertise:-1. New CPU/chipset/netcomm Flip-Chip packaging technology Factory Certification 2. Lead and own NPI (new product introduction) certification in defining, planning and executing the speculative reliability requirements to meet product use conditions prior to launching new product. 3. Product Reliability environmental stressing/ accelerated life testing (Preconditioning, temperature cycling, high temperature bake, HAST) to understand package failure mechanism 4. Perform reliability statistic modeling to derive failure mechanism model parameters which are used to compute the equivalence of stress required that will envelope the package operating life goal under a specific field use condition. 5.Leading Q&R team on substrate certifications for new technology, new suppliers and supplier’s expansion. Reliability modeling experienced on substrate related failure mechanisms 6. Lead factory team in resolving major critical quality issues seen by customers (SMT) including root cause analysis, containment and corrective actions & recovery plan for customers.7. Content expert in qualifying new process and equipment in the manufacturing floor8. Performed risk assessment(Customer line fallout and field reliability DPM) and disposition for questionable materials

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  Universiti Sains Malaysia

  Research Mode