 Manage and lead a group of Quality & Reliability Engineers (QRE) to support factory’s qualification projects, New Product Launch certifications, Yield & Quality improvement projects, external customer issues, indirect/direct new material qualitification and etc.  Sets and communicates expectation/goals to the engineers Define people development plan and builds engineer’s technical skills to solve engineering and quality issues  Oversee overall alignment in QRE resource to support various QRE roles Recruiting and training new QREs Chartered to lead reduction in quality issues to drive for zero quality incident Sits in the Process Change Control Board that reviews and approves process change White Papers with regards to quality & reliability aspects

 Lead and own certification for NPI (new product introduction) in defining, planning and executing the speculative reliability requirements  Certifying new CPU/chipset/netcomm Flip-Chip packaging technology for factory using use condition failure mechanism based and reliability statistics.  Chairs and coordinates the Quality readiness team for NPI to ensure flawless NPI startup Experience as EI (Early involvement) with Technology Development Group - Subject components to environmental stressing/ accelerated life testing (Preconditioning, temperature cycling, high temperature bake, HAST) to understand package failure mechanism associated with the new technology. Perform reliability statistic modeling to derive failure mechanism model parameters which are used to compute the equivalence of stress required that will envelope the package operating life goal under a specific field use condition.  Vast experience in leading Q&R team on substrate certifications for new technology, new suppliers and supplier’s expansion. Reliability modeling experienced on substrate related failure mechanisms  Lead factory team in resolving major critical quality issues seen by customers (SMT) including root cause analysis, containment and corrective actions & recovery plan for customers. Design of Experiment to identify and resolve excursion/technology issues. Work closely with internal stakeholders to root cause failure mechanism and provide fixes to issues. Content expert in qualifying new process and equipment in the production floor Performed risk assessment(Customer line fallout and field reliability DPM) and disposition for questionable materials

 Handles daily routine LYA (Low Yield Analysis) to report out its failure mode and failure mechanism on LCD panels – LCD circuitry shorts/open; FM, optical & cosmetic failures. Drives process and yield improvement projects from the LYA findings. Performs in depth Failure Analysis (FA) on customer returns and engineering evaluation lots. Prepares 8D report for customer on the derived FA findings; drives corrective actions and preventive actions from the R/C findings.  Possesses process knowledge on LCD manufacturing especially in Photoresist patterning wet line processes – photoresist coating, exposure, developing and etching/stripping processes.