As a Principal Hardware Engineer at TAP Engineering, I am passionate about developing innovative and cost-effective solutions for the future of domestic advanced packaging using fan out wafer level technologies. I have over 25 years of experience in the field of microelectronics, MEMS, and thin films, and I have extensive knowledge of design for manufacturing, fabrication techniques, the equipment market, and reliability of these emerging devices and systems.In my previous roles, I have led and managed multiple projects and teams across different a few different organizations, delivering high-quality products and services to customers and partners. I have also contributed to the growth and development of the industry by generating multiple patents and publications. I am always eager to find new collaborations with diverse stakeholders, and solve complex engineering challenges in Advanced Packaging.