Krishna Theja
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Krishna Theja Email & Phone Number

IC Packaging R and D Engineer at Intel Corporation
Location: Bengaluru, Karnataka, India 5 work roles 1 school
1 work email found @intel.com LinkedIn matched
✓ Verified Jun 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email k****@intel.com
LinkedIn Profile matched
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Current company
Role
IC Packaging R and D Engineer
Location
Bengaluru, Karnataka, India
Company size

Who is Krishna Theja? Overview

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Quick answer

Krishna Theja is listed as IC Packaging R and D Engineer at Intel Corporation, a company with 114813 employees, based in Bengaluru, Karnataka, India. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Krishna Theja.

Krishna Theja previously worked as IC Packaging R&D Engineer at Intel Corporation and Senior PCB Designer at Ust. Krishna Theja holds Bachelor Of Engineering - Be, Electrical, Electronics And Communications Engineering from Anna University.

Company email context

Email format at Intel Corporation

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{first}.{last}@intel.com
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AeroLeads found 1 current-domain work email signal for Krishna Theja. Compare company email patterns before reaching out.

Profile bio

About Krishna Theja

Experienced IC Package Designer & Senior Printed Circuit Board with a demonstrated history of working in the information technology and services industry. Skilled in FCBGA packages, Wirebond packages, Debugging, Radio Frequency (RF), Embedded Systems and Electronics. Strong engineering professional with a Bachelor of Engineering - BE focused in Electrical, Electronics and Communications Engineering from Anna University.

Listed skills include Pcb Design, Electronics, Embedded Systems, Manufacturing, and 6 others.

Current workplace

Krishna Theja's current company

Company context helps verify the profile and gives searchers a useful next step.

Intel Corporation
Intel Corporation
IC Packaging R and D Engineer
Bengaluru, KA, IN
Website
Employees
114813
AeroLeads page
5 roles

Krishna Theja work experience

A career timeline built from the work history available for this profile.

Ic Packaging R&D Engineer

Current

Bengaluru, Karnataka, India

Feb 2021 - Present

Senior Pcb Designer

Ust

Penang, Malaysia

Nov 2016 - Jan 2021
Team & coworkers

Colleagues at Intel Corporation

Other employees you can reach at intel.com. View company contacts for 114813 employees →

1 education record

Krishna Theja education

FAQ

Frequently asked questions about Krishna Theja

Quick answers generated from the profile data available on this page.

What company does Krishna Theja work for?

Krishna Theja works for Intel Corporation.

What is Krishna Theja's role at Intel Corporation?

Krishna Theja is listed as IC Packaging R and D Engineer at Intel Corporation.

What is Krishna Theja's email address?

AeroLeads has found 1 work email signal at @intel.com for Krishna Theja at Intel Corporation.

Where is Krishna Theja based?

Krishna Theja is based in Bengaluru, Karnataka, India while working with Intel Corporation.

What companies has Krishna Theja worked for?

Krishna Theja has worked for Intel Corporation, Ust, Embdes Technologies Pvt Ltd, and Sienna Ecad Technologies Private Limited.

Who are Krishna Theja's colleagues at Intel Corporation?

Krishna Theja's colleagues at Intel Corporation include Monika Bahyrycz, Caseen Sze, Shubham Pandey, Ubong I., and Kok Hong Choe.

How can I contact Krishna Theja?

You can use AeroLeads to view verified contact signals for Krishna Theja at Intel Corporation, including work email, phone, and LinkedIn data when available.

What schools did Krishna Theja attend?

Krishna Theja holds Bachelor Of Engineering - Be, Electrical, Electronics And Communications Engineering from Anna University.

What skills is Krishna Theja known for?

Krishna Theja is listed with skills including Pcb Design, Electronics, Embedded Systems, Manufacturing, Testing, Analog, Rf, and Hardware Architecture.

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