Leon Wu Email & Phone Number

台灣 高雄市 楠梓區

台灣 臺南市 善化區

Fan out panel level package with the largest panel size in semiconductor field.

台灣 臺南市 善化區

ChipMOS (New Product Development Management Center) Tainan, Taiwan Project manager November 2015 – September 2021 To introduce Cu coating Pd wire product to HVM FIVE patents were certificated by Intellectual Property Office (IPO, Taiwan) TW I560834B (20161201) : Flip chip package and chip TW I550805B (20160921) : Multi-chip stack package TW I560123B (20161201) : Disk-like semiconductor package & combination with tray TW I556359B (20161101) : QFN package structure… Show more ChipMOS (New Product Development Management Center) Tainan, Taiwan Project manager November 2015 – September 2021 To introduce Cu coating Pd wire product to HVM FIVE patents were certificated by Intellectual Property Office (IPO, Taiwan) TW I560834B (20161201) : Flip chip package and chip TW I550805B (20160921) : Multi-chip stack package TW I560123B (20161201) : Disk-like semiconductor package & combination with tray TW I556359B (20161101) : QFN package structure and lead-frame thereof TW I678742B (20181015) : Semiconductor assembly structure Qualified & introduced turnkey product to mass production included bumping, assembly & test (Cu pillar, FCQFN) Cross – site coordinator and integrated 3 site result as technical contact window Developed fan-in WLCSP technology with 5 side mold compound protection Developed fan-out WLCSP with compression molding and unique die carrier Trained a senior engineer to well control the key projectChipMOS (Project Management Department III) Tainan, Taiwan Senior project engineer January 2007 - November 2015 Top1 performance ranking is more than 7 years. Be promoted to new product technical section manager due to well project managementexperience and product development sense in 2015 Earned a best personal excellence award and bonus due to saved more than 2.5 million NTD eachyear in 2012 (changed leadframe from pre-taping type to pre-mold tape) Introduced advanced products to high value mass production during 2011 ~ 2014, such asWLCSP, sawn type FCDFN / FCQFN Introduced traditional products to high value mass production, such as wire bonding punch /sawn QFN, miniBGA, VFBGA, QFP and etc.. Defined QFN & BGA control plan, process flow, bill of material. (BOM) Maintained the assembly yield & FT yield, and keep improved top3 assembly & FT yield loss. Summarized new product assembly & reliability qualification report Be a cross – department coordinator to overcome QRA, RMA, low yield improvement Show less

台灣 Kaohsiung City 楠梓區