Mark Derwin Email & Phone Number

Tempe, Arizona, United States

I am pleased to be working back in a technical role with some of the most advanced materials made in the United States. I will help guide you in the selection and fabrications of some of the best laminates to serve the high speed digital and 5G markets. I am working with product development on the lowest loss and control Dk printed circuit board laminates..

Morrisville, NC

Development of advanced 3D and 2.5D packaging utilizing both conventional packaging technologies as well as Oxide bonding and DBI bonding process for the most advanced wafer to wafer and chip to chip assembly. Focus on aerospace and defense markets.

I am excited to be back working with my customer base on advanced flex, rigid and rigid flex applications. Feel free to contact me if you have any packaging needs. We have been working with customers across the technology spectrum from chip packaging, medical, industrial and the exciting 5G communications.

Wake Forest, NC

Technical Sales engineer for micro-electronic packaging covering all accounts on the east coast.Responsible for new business development, leveraging Engent's unique assembly capabilities.

Sales engineering aerospace & defense

Expand HEI's influence in the military/aerospace and medical markets.

Bs, Industrial Engineering

As, Mechanical Engineering