Mark Luckeroth Email & Phone Number
@intel.com
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Who is Mark Luckeroth? Overview
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Mark Luckeroth is listed as Principal Engineer - Thermal System Integration at HP, a with 148783 employees, based in Portland, Oregon, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Mark Luckeroth.
Mark Luckeroth previously worked as Principle Engineer, thermal systems at Hp and Thermal Architect - Supercomputing Group at Intel Corporation. Mark Luckeroth holds Masters Of Science, Applied Mathematics from University Of Washington.
Email format at HP
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AeroLeads found 1 current-domain work email signal for Mark Luckeroth. Compare company email patterns before reaching out.
About Mark Luckeroth
Thermal-Mechanical Product Design Engineer with strong background in project management and electronics cooling. I was the Lead Thermal Engineer for the Aurora Supercomputer. I have a passion for technical problem solving using both simulation and empirical test methods with experience in bring complex systems from concept to validated HVM product.
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Mark Luckeroth work experience
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Principle Engineer, Thermal Systems
Thermal Architect - Supercomputing Group
Working with a small team of technical leaders to define the architecture for the next generation of GPU based High Performance Computing clusters. Responsible for system cooling strategy and new technology development and industry enabling. Mentoring a team of thermal engineers to drive rapid concept development, thermal simulation, and prototype testing.
Lead Thermal Engineer - Aurora Supercomputer
Lead thermal engineer responsible for design, analysis, and validation of the Aurora Super Computer Exa-scale Compute Blade. Led a team of thermal engineers through early concept development and design down-selection to full HVM production, system validation, and customer deployment. Developed single phase liquid cooled design capable of >5kW cooling in 1U sled.
Supercomputing Cluster Thermal Engineer
Super computer system concept development: Responsible for leading a team of thermal experts to develop a highly optimized liquid cooling system for a TOP500 super computer to be deployed at Argonne National Laboratory. Early concept development, design refinement, detailed fluid dynamics analysis for electronics cooling. Engineering design requirements documentation, prototype development and testing, and numerical model validation. Super computer system pathfinding: Member of a small team of engineers tasked with developing a system design proposal for a TOP500 super computer to be deployed at Lawrence Berkeley and Sandia National Laboratories. Responsible for concept development, high level system thermal analysis, and hardware cost analysis.
Thermal-Mechanical Product Validation Lead
Lead an engineering team of thermal and mechanical engineers to complete and validate the hardware design for an HPC Product. Responsible for documenting product engineering requirements, owning the hardware product development schedule, setting design strategy, and driving clarity in the design process. Developed Product Validation plan with Q&R Engineer, conducted metrology capability analysis, developed new test procedures and qualified final product design for market release.
Thermal Engineer
Completed detailed heat transfer and fluid dynamics analysis for electronics cooling hardware for High Performance Computing products. Responsible for design optimization, design concept generation, and feasibility studies, using both 1st order hand calculations and CFD analysis tools. Generated empirical test strategy for prototype testing and model correlation. Applied structured problem solving methods to root cause design performance issues and generate new design solutions. Developed Monte Carlo statistical model for predicting thermal performance for multi-chip processor packages where traditional modeling methods failed to yield productive results.
Mechanical Design Engineer
PCIe Add-in card Product development, mechanical design, prototyping, and HVM supplier ramp. Responsible for design mechanical function analysis, tolerance analysis, production drawings, and supplier management.
Colleagues at HP
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Riya Ranjan
Colleague at HpJharkhand, India
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Chiang Howard
Colleague at HpTaiwan, Province Of China
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Jonathan Ching Cdcdp
Colleague at HpLondon, England, United Kingdom
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Patricia De Pedro
Colleague at HpGreater Barcelona Metropolitan Area, Spain
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Rui Qi Wee
Colleague at HpSingapore
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Bento Silva
Colleague at HpMetropolitan Fresno, United States
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M Nethaji
Colleague at HpChennai, Tamil Nadu, India
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Tanushree C
Colleague at HpBengaluru, Karnataka, India
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Domanic Marshall
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Dick Long
Colleague at HpBrampton, Ontario, Canada
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Mark Luckeroth education
Masters Of Science, Applied Mathematics
Bachelor Of Science (B.S.), Mechanical Engineering
Frequently asked questions about Mark Luckeroth
Quick answers generated from the profile data available on this page.
What company does Mark Luckeroth work for?
Mark Luckeroth works for HP.
What is Mark Luckeroth's role at HP?
Mark Luckeroth is listed as Principal Engineer - Thermal System Integration at HP.
What is Mark Luckeroth's email address?
AeroLeads has found 1 work email signal at @intel.com for Mark Luckeroth at HP.
Where is Mark Luckeroth based?
Mark Luckeroth is based in Portland, Oregon, United States while working with HP.
What companies has Mark Luckeroth worked for?
Mark Luckeroth has worked for Hp and Intel Corporation.
Who are Mark Luckeroth's colleagues at HP?
Mark Luckeroth's colleagues at HP include Riya Ranjan, Chiang Howard, Jonathan Ching Cdcdp, Patricia De Pedro, and Rui Qi Wee.
How can I contact Mark Luckeroth?
You can use AeroLeads to view verified contact signals for Mark Luckeroth at HP, including work email, phone, and LinkedIn data when available.
What schools did Mark Luckeroth attend?
Mark Luckeroth holds Masters Of Science, Applied Mathematics from University Of Washington.
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