Assembly Process Engineer
CurrentDevelop and improve the tools and processes for die singulation, die attaching, and wirebonding to be used in the fabrication of monolithically integrated optical circuits in a 24x7 manufacturing and development facility.Analyze and improve manufacturing processes to meet key performance indicators including efficiency, cycle time, yield, and reliability.Qualify new assembly processes and technologies to enable and support the production of the next generation of photonic integrated circuits.Own assembly area and processes for all products from the feasibility stage through development to volume production.