Mark Woolley Email & Phone Number

I have worked in Failure Analysis of Electronics for more than 20 years. I have covered areas such as PWB, and IC technologies, component structure and failure modes. I differentiate between the failure mode and the mechsnism behind the failure during the detection of the Root Cause of Failure.The Root Cause leads directly to a Corrective Action to prevent the failure from occurring again. Corrective Actions can include design changes to the circuitry, component changes, and interaction with the component manufacturer to request a revision of the component.

Listed skills include Operation And Interpretation Of Sem/Edx Data, Operation And Interpretation Of X Ray Images In Electronics, Cross Sectioning And Polishing, Rohs Materials Experience In Reliability Analysis, and 13 others.

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  Failure Analyst

  Avaya

  Oct 2001 - Present - Colorado

  Lead Failure AnalystTechnical Level supervision of other analysts, including training in techniques, assisting in failure location and analysis.Training team members in analysis techniques and equipment, including SEM/EDX, Standard X-Ray, X-ray Fluorescence elemental identification, cross sectioning and polishing, wet chemistry, and other analysitcl techniques.

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  University Of Utah

  Biology (Genetics)