Mark Blocker Email & Phone Number

Global Supply Chain Business management;Drive Price/Cost Analysis, audit deep dives, and process improvement efforts across sector Divisions.Maintains Aeronautics Systems’ Price/Cost Analysis procedures, templates, tools, and guidelines.Develop and deliver training in Price/Cost Analysis practices to all process participants, including Supplier Management, Price/Cost Analysts, and Technical Evaluators.Develop mechanisms to measure and monitor Price/Cost process compliance and drive consistency and accountability across all Division proposal efforts.

Tempe, Arizona, United States

• Completed 32 FAR compliant cost volumes valued at $350M for engineering, production, and software related proposals to customers in the 1H to 2020 Plan. In last 18 months completed $1.5B TINA contracts at 95% on time delivery to the customer. • Drove 50% cycle time reduction of internal estimation process (labor, material, services) through collaboration with technologists to integrate software to facilitate completion• DFAR/FAR/CAS subject matter expert and peer reviewer of contractor and outside bids for compliance and contract requirements. • Developed pricing strategy that increased margin percentage for FFP contracts at 97% on time delivery of cost proposal to the customer. • Drove team metric performance thru best practice knowledge sharing and training-achieved 97% on time delivery of cost proposals to the customer.• Achieved 100% program completion cycle time of financial analysis for 32 proposal deliveries in 2020.• Developed training package and certified 30 analysts on Propricer estimating system to meet corporate training requirement within 2 months of hire.

Glendale, Arizona, United States

Identify and drive critical material, process and product improvement in cycle time, quality, capability, and manufacturability for complex mechanical/electrical assemblies. • Implemented process improvements based on root cause investigation that resulted in reduced rework cost of assembly to exceed goal by 25% and increase profit margin of fixed price long term contract.• Led next generation manufacturing improvement team that reduced baseline build touch labor by 46% and cut cycle time in half through value engineering activities.• Qualified electronic metrology to replace manual system that reduced system variation by 50%.• Eliminated insufficient solder of plated through hole joints using stiffener to improve yield 8%.• Reduced cycle time by 50% through Sigma value stream mapping to close QN and supplier MRB requests (as Senior Quality Engineer / Manpower contractor for Honeywell January to June 2012)

Formerly White Electronic Designs Phoenix, Az

Managed all aspects of design, development, and qualification for PBGA, SCSP, and CCA products for internal and customer projects. Owned P&L, supplier development, and customer interaction thru lifecycle.• Managed the design, development, production, supply chain, and certification per MIL STD 883, J-STD-001, and J-STD-610 of GPS electronics circuit cards that accounted for $30 M product revenue. • Managed design change validation due to obsolescence of Tomahawk cruise missile GPS receiver CCA component and MIL STD 883 certification that resulted in no supply chain interruptions.• Managed program P&L and prototype development leading to low volume production for NASA module to comply with ITAR, and MIL-STD883 quality & reliability requirements on schedule below cost targets.

Managed advanced substrate business for commercial and aerospace markets requiring high Tg material properties for reliability.

Sourcing operations manager for assembly equipment for CCA and FCBGA assemblies. Managed team of engineers responsible for benchmarking, supplier development, and gap closure plans.• Lead technical advisor for team to drive acquistions to close gaps in assembly technology based on organization objectives, long range planning and business development needs. • Lead standardized Supplier assessment scorecard and assembly equipment selection methodology to quantify supplier proposals that resulted in 25% reduction in cycle time from kick off to delivery.• Managed cross organizational team that developed supply base and implemented SEMI standards and new technologies for 300mm die preparation equipment at device packaging assembly sites.• Assembly Equipment Chair responsible for management of integrated supply chain that delivered sourcing and capital to meet divisional capacity, finance, and engineering requirements with $150M budget.

Managed engineering team that drove R&D to meet product, cost, & manufacturing requirements. • Led value engineering, supplier development for cost reduction, and lean manufacturing techniques which resulted in cost savings of $300M for FCBGA underfill high volume microprocessor modules. • Managed underfill material modification that eliminated stress induced conductor trace cracking and ‘opens’ failures using chip/package modeling and material characteristics to redesign for reliability.Laser Micromachining: US Patent# 20060088984 (application)

Mba, Supply Chain/Economics

Bachelors Science, Chemical Engineering