AT TSMC, I help manage and oversee tool sets in wafer production. This position demands meticulous attention to detail and quality, along with effective communication. I facilitate these skills among technicians to ensure production aligns with TSMC's high standards, enabling seamless operations and timely issue resolution. My focus on quality and collaboration with others is essential for maintaining optimal production efficiency and adherence to supreme wafer quality for our customers.

At Intel, we strove to make every aspect of semiconductor manufacturing state-of-the-art. From process development and manufacturing, through yield improvement, packaging, final tests and optimization, and world class Supply Chain support. Employees in the FOUPWash Department and Manufacturing Groups are part of a worldwide network of ensuring every wafer is capable of becoming a successful processor. All focused on utilizing the power of teamwork and determination to bring smart, connected devices to every person on Earth. This role required a range of duties, including but not limited to:• Operated technical equipment and analytical tools in an ESD cleanroom environment.• Was responsible for issuing daily pass downs on behalf of my team to incoming shift.• Utilized cutting-edge equipment and tools to complete duties such as processing, and industrial washing of FOUPS.• Organized the packaging of over 140 CU and Non-CU lots per night, using bagging tools. These lots were to be shipped to other Intel fabs across the globe, such as Israel, Oregon, Ireland, etc.• Oversaw the production procedures of the 10nm wafer starts team who were using the SIP stockers. Ensuring everyone was adhering to Intel’s steps to ensure smooth and safe production.• Performed various PMs on tools used by the FOUPWash team, such as SIPs, AFW tools, and the actual FOUPS.• Ensured that FOUPS were purged and the appropriate amount and times in order to be safe to use again for wafer production.

At Intel, we strove to make every aspect of semiconductor manufacturing state-of-the-art. From process development and manufacturing, through yield improvement, packaging, final tests and optimization, and world class Supply Chain support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and fabs, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth. This role required a range of duties, including but not limited to:• Setup processing machines like SIPs across Intel’s fab 12, fab 32, and fab 42.• Monitored and collected all completed wafers and prepared them for global transport.• Processed and stored 12” 14nm and 10nm wafers in Intel’s cutting-edge cleanroom environment.• Maintained several one-on-one communications with the silicon team, as well as Intel employees to ensure smooth and maximized wafer production. Displaying excellent communication and leadership skills. • Utilized software such and WIINGS, WIPTrack, LOT Dispatch, and LOT Detail for tracking purposes, and to ensure we never missed a lot or FOUP in production. Performance was and is my focus.• Ensured seamless flow of materials to and from warehouse, facilitating the transit of clean and dirty FOUPs throughout Intel’s Ocotillo campus.• Used Microsoft Outlook and Teams to keep my managers and supervisors up to date throughout the shift.