Michael Chew
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Michael Chew Email & Phone Number

Senior Si Consultant at TE Electrnics Data and Device
Location: Shenzhen, Guangdong, China 5 work roles 1 school
1 work email found @hong-lin.com.cn LinkedIn matched
✓ Verified August 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email

Work email m****@hong-lin.com.cn
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Current company
TE Electrnics Data and Device
Role
Senior Si Consultant
Location
Shenzhen, Guangdong, China

Who is Michael Chew? Overview

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Quick answer

Michael Chew is listed as Senior Si Consultant at TE Electrnics Data and Device, based in Shenzhen, Guangdong, China. AeroLeads shows a work email signal at hong-lin.com.cn and a matched LinkedIn profile for Michael Chew.

Michael Chew previously worked as Senior High Speed Raw Cable and Cable Assembly Si consultant at Te Electrnics Data And Device and Vice President at Ni-Connect Llc. Michael Chew holds Architecture from University Of Detroit Mercy.

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Email format at TE Electrnics Data and Device

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{first}.{last}@hong-lin.com.cn
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Profile bio

About Michael Chew

+86 13812766509+1 626 3775540

Listed skills include Manufacturing, Cables, Product Development, Supply Management, and 15 others.

Current workplace

Michael Chew's current company

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TE Electrnics Data and Device
Te Electrnics Data And Device
Senior Si Consultant
5 roles

Michael Chew work experience

A career timeline built from the work history available for this profile.

Senior High Speed Raw Cable And Cable Assembly Si Consultant

Current
Te Electrnics Data And Device

Dongguan, Guangdong, China

Resposibility in TE Connectivity include:1. Bulk(Raw) Cable In House: Advising TE Dongguan China and Hermosillo Mexico in 112/224 Gbps Bulk Cable design and develop manufacture process. Also include SI validation, Si issues analysis, develop DOE process, provide highspeed SI training, and fine tune manufacture process. 2. Provide suggestions to supply chain and outsource private label solutions to help company ease mass production bottle neck.3. Cable Assembly: Develop a customized automated All in One pre solder wire treatment equipment for TE assembly. This equipment will combine complex precision al/mylar cut and strip, dielectric cut and remove, and conductors and drain wires forming process.4. Turn Parallel Gap Resistant Welding into Parallel Gap Resistant Soldering (PGRS) process for DAC and ICC with improved Si performance for 112 and 224G production lines.5. Continue to develop PGRS with automatic cable and solder pads adjustment control for 112-224G cable assemblies. 6. Continue to solved Si and improve production yield rates for legacy products such as 28-56G OSFP, QDD, CDFP and PCIE 4/5. Maintain yield rate close to 97/99.8 percent.

Apr 2020 - Present

Vice President

Ni-Connect Llc

California Usa, Shenzhen China

Working with a group of elite engineers in providing Engineering, Technical solution, SI Analysis, Marketing Strategy and Consultation in High speed Cable Extrusion and Cable Assembly process automation in High speed assembly such as 56-112G OSFP, QDD, and High Speed internal cable such as YV3, MCIO. Currently servicing some of the well established Global Companies in China such as but not limited to TE, Superlink..

Sep 2019 - Jun 2024

Senior Engineering Director

Joinsoon Electronics Mfg. Co. Ltd.

Qing-Xi, Dongguan City, Guang-Dong Province, Prc.

Develop and manage manufacturing process for TB3/USB4 coax Cable extrusion up to 40 G and Cable assembly process. Principle SI analysis & Suggest process optimisation for best SI performance.

Sep 2016 - Sep 2019

General Manager

Hl Technology

Changsu City, Jiangsu Province, China

Cable, Connector and cable assembly manufacturingKey role in Development and production of first High Speed TB, SFP,QSFP cable extrusion and production of first generation C.cast HDMI cable assembly. One of the first in the industry to implement full assembly and termination automation in USB series cable.

Aug 2011 - Dec 2014

Director Of Global Sourcing

Employ at Volex Group Inc. with multiple roles includingSupply chain manager, Sourcing manager, Global engineering and production transfer program manager, interim General manager for two years in Suzhou facility, Global Sourcing Director in charge of 13 facility in 6 countries. Create High Speed Interconnect Business Development Team. One of my main responsibilities was to establish a High Speed interconnect development team from scratch in Volex and also develop new customers and business related to high speed interconnect products.

May 2004 - Jul 2011
1 education record

Michael Chew education

FAQ

Frequently asked questions about Michael Chew

Quick answers generated from the profile data available on this page.

What company does Michael Chew work for?

Michael Chew works for TE Electrnics Data and Device.

What is Michael Chew's role at TE Electrnics Data and Device?

Michael Chew is listed as Senior Si Consultant at TE Electrnics Data and Device.

What is Michael Chew's email address?

AeroLeads has found 1 work email signal at @hong-lin.com.cn for Michael Chew at TE Electrnics Data and Device.

Where is Michael Chew based?

Michael Chew is based in Shenzhen, Guangdong, China while working with TE Electrnics Data and Device.

What companies has Michael Chew worked for?

Michael Chew has worked for Te Electrnics Data And Device, Ni-Connect Llc, Joinsoon Electronics Mfg. Co. Ltd., Hl Technology, and Volex.

How can I contact Michael Chew?

You can use AeroLeads to view verified contact signals for Michael Chew at TE Electrnics Data and Device, including work email, phone, and LinkedIn data when available.

What schools did Michael Chew attend?

Michael Chew holds Architecture from University Of Detroit Mercy.

What skills is Michael Chew known for?

Michael Chew is listed with skills including Manufacturing, Cables, Product Development, Supply Management, Continuous Improvement, Mrp, Lean Manufacturing, and Strategic Sourcing.

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