Michael Durnil Email & Phone Number

Fort Collins, CO, US

• Head of all NPI Sensors Commodity Management for Amazon Lab126.
• Own NPI EE Commodity Management for all Amazon Echo Show/Multimodal consumer devices, confidential and special projects.
• Manage new development and commodity on key chipsets such as SoCs, PMICs, Wi-Fi, ASICs, etc. for next generation consumer products.
• Drive next generation technology investigations with key partners and cross-functional teams.
• Drive escalations and resolution with strategic partners, engineering teams and Leadership.
• Manage Exec Reviews, Cost Negotiations with proven cost savings and Strategic Roadmaps.

Fort Collins, Colorado, United States

• Principal Global Strategic Sourcing Manager for Application Specific Integrated Circuits (ASICs), Intellectual Property (IP), Applications Specific Standard Products (ASSPs) and CPUs.
• Accountable for HPE Global Strategic direction and execution for Enterprise Intel and AMD CPUs. Manage CPUs across multi-billion portfolio for HPE Enterprise Servers.
• Lead price negotiations and cost models for all ASICs, Raid-On-Chip ASSPs, CPUs, PCAs with strategic suppliers to reduce business cost impacts and resolve funding gaps.
• Champion the leadership team with Directors from Marketing, R&D Engineering, Legal and Procurement to align on direction, supplier selection, strategic negotiations, core decisions and escalations for NPI programs and.
• Provide strong communication with HPE executive management team for escalations on critical and high-risk issues for internal and supplier disconnects.
• Initiated and drove cost savings and cost avoidance activities for current ASIC portfolio by $25M that exceed executive key performance goals and fiscal year targets.

Fort Collins, Colorado, United States

• Lead Intel EX processor line execution and strategy for New Product Development Business Critical Servers division. Implemented new strategies for risk management on Silicon Chip turns to accelerated Ship Release.
• Managed end-to-end Intel’s Memory buffer, IO Hub chipsets for HP Global Business Units.
• Lead HP and Intel Processor and ASIC co-validation team and risk mitigation. Developed new methods of testing and qualification for CPUs, Memory DIMMs, ASICs, which later became standards for future programs.
• Successfully executed on program schedule, prototyping, system integration, and risk management to meet all major milestones on-time and on budget.
• Pro-actively drove whitespace to reduce/eliminate critical path program blockers.
• Developed new NPI lifecycle process and milestones for CPUs and ASIC chipsets to streamline deliverables and overhead for several business units within HP. Recognized and for innovation and forward thinking.

Fort Collins, Colorado, United States

• Lead for 16/8 socket mid-range and IO expander Enterprise Servers.
• Managed exceptionally large cross-functional team (200+) from concept to world-wide Ship Release.
• Leadership role for all program management functions in areas of Core team, System team, Prototypes, Integration, FW, and SW Management.
• Defined program strategy, direction, risks, ship release requirements and schedule milestones.
• Develop new NPI processes for quality, testing, change requests, risk management and escalations.
• Led cross-functional teams to provide most cost-effective method for field upgrades strategy and deliverables that resulted with an improved total customer experience. Received excellent customer feedback.