Michael Jansen Email & Phone Number

- Managed mfg engineering, production, automation, clean room facility set up, equipment maintenance & tooling projects including supervising and training mfg/process engineers, tech's & operators. - Introduced and set-up new Polymer Flip Chip Assembly Lines in new Manufacturing Facilities.- Developed and documented processes for manufacturing Polymer Flip Chip Assemblies, Thick-film Hybrid Circuit Assemblies, Surface Mount, Through-hole and mixed Technology PCB Assemblies.- Presented Technical Papers on Polymer Flip Chip Technology at InterNepcon ’98, Japan and Nepcon East ’98, Boston. - Responsible for justification, evaluation and implementation of Polymer Flip Chip and PCA Manufacturing Lines.