Providing direct customer support and training for complex multi-discipline systems. Program management for all aspects of system operation including system installation, troubleshooting, maintenance and system performance.• Lead for multi-week training program prior to system installation. Responsible for product integration of OEM or COTS based electromechanical systems.• Daily interaction with government customer spanning low level to high level. Facilitates exchanges of technical and business information between organizations and within work groups. • Implemented quality control system for system component non-conformances. Reduced component repeat downtime by 35%.

Quality Engineer on multiple programs developing space communications systems including hybrids (MCM’s), CCAs, modules, and deliverable sytems. Overseeing quality functions at all levels of program activity including production, testing, integration, qualification testing, and customer interface. Additional experience in space structures.• Investigates defects to develop disposition, root cause and establish corrective actions to drive continuous improvement. Applies trend and pareto analysis of results Establishes quality plans and R/I requirements. Extensive experience J-STD-001, IPC workmanship standards. • Spearheaded cross-functional team to improve customer source inspection (CSI) performance. Reduced customer findings by >50% after project implementation. Additional leadership for initiatives utilizing Six Sigma and Lean concepts, PFMEA, RCCA analysis. • Lead customer liaison for program audit activity including QMS and product audits. AS9100/O/ISO 9001 quality systems experience. Experience with presenting to customer.

Manufacturing Engineer on team tasked with developing MIL-PRF-38534, Class K and H multi-chip modules for high reliability space communications applications. Led manufacturing technical aspects of production for medium volume production build, applying workmanship and performance standards Mil-Std-883 and J-STD-001 Space Addendum.• Team lead for high reliability microelectronics assembly processing. Responsible for comprehensive aspects of build including die attach, wire bonding, dispensing, hermetic sealing. Additional ownership of environmental testing aspects such as thermal cycling, random vibration and TVAC. • Led cross-functional team to develop AOI methodology for SPC of epoxy dispense and in-product verification of dispense pattern and component placement (gap measurements). Program reduced post pick-and-place rework by >30%.• Seamless collaboration across disciplines such Test and RF Engineering to address FRB, MRB and RCCA actions. Additional program support in production planning and scheduling.

Responsible for process sustaining, improvement, and development in Etch technology area of high-volume semiconductor manufacturing facility. Managed activities between Engineering, Production and Maintenance to improve product yields, throughput, and reduce costs.• Extensive experience with Lean Six Sigma tools, such as Design of Experiments, 8D problem solving, Analysis of Variance, FMEA and Statistical Process Control to drive sustainable improvement to processes and increase product quality and reliability. • Led engineering team in addressing device leakage failures on key technology. Developed process solutions in metal etch module that resulted in technology cost savings of $30k per quarter.• Led cross-functioning team to implement automation, electronic data collection and streamline standard-operating procedures at metal etch toolset. Developed training plan for new procedures. Improvements resulted in $55k of cost savings per year.• Hands-on engineer with “do what it takes” attitude. Worked closely and effectively with operators, maintenance, and fellow engineers to proactively solve problems and improve cycle time.