Electronical Engineer Technician Vi
Current- Solder to the Component level; SOIC, DFN, TQFP, BGA, 0402 and 0201 components.-Troubleshooting abilities to locate problems to component level and identify solutions for new designs and in production products.-Support.
- Package constraints with mechanical concept and mounting features
- Determine PCB size constraints (X, Y, & Z) and mounting hole locations.
- Thermal design with heat sink and airflow requirements
- Review completed physical design and procure hardware when complete
- Merge other CAD drawings with Layout (.dwg,.dxf)