Michael Mindel

Michael Mindel Email and Phone Number

Adjunct Faculty @ Indiana Tech
Zionsville, IN, US
Michael Mindel's Location
Zionsville, Indiana, United States, United States
Michael Mindel's Contact Details

Michael Mindel work email

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About Michael Mindel

Summary: Materials Science professional with significant experience in the electronics industry developing new and better processes and products. Proven track record oftechnological breakthroughs in consumer and industrial electronics. Seeking opportunities to leverage problem solving and technological creativity for startup/venture creationSpecialties: consulting, lean manufacturing, continuous improvement, data collection, thin film production, process modeling, process optimization, electronic packaging, process engineering, quality, soldering, spc, statistical process control, validation,

Michael Mindel's Current Company Details
Indiana Tech

Indiana Tech

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Adjunct Faculty
Zionsville, IN, US
Michael Mindel Work Experience Details
  • Indiana Tech
    Adjunct Faculty
    Indiana Tech
    Zionsville, In, Us
  • Indiana Tech
    Adjunct Faculty
    Indiana Tech Oct 2009 - Present
    Teach Business Statistics
  • Datm, Llc
    Director Of Engineering And Quality
    Datm, Llc Apr 2009 - Present
    Product DesignOutsourcingSupplier Quality
  • Michael J Mindel
    Owner
    Michael J Mindel Apr 2009 - Present
    Consultant Contract EngineeringNew Product Introduction, APQP, Product TransferTransfer of products from Asia to Norh America
  • Total Electronics
    Quality/Process Engineer
    Total Electronics Feb 2004 - Apr 2009
    Developed system for calculating line capacity and line rate studies for labor estimates used for external quotes and to set internal standards as well as for starting production using lean principles.Invented packaging system for depaneling and shipping very small printed circuit board assemblies that greatly reduces handling costs, and retains traceability at the individual board level.
  • Kelly Scientific
    Engineer
    Kelly Scientific Aug 2003 - Jan 2004
    Working at Eli Lilly performing failure analysis on reuseable syringes and preparing reports to meet FDA requirements.
  • Crew Technical Services
    Technical Writer
    Crew Technical Services Mar 2002 - Nov 2002
    Updated and rewrote Eli Lilly process validation procedures, SOPs and other cGMP documents. Set up resource modeling software for Lilly Global FacilitiesDevelopment.
  • Acterna
    Engineer
    Acterna 1998 - 2002
    Project managementManufacturing engineerQuality engineer
  • Acterna
    Manufacturing/Project Engineer
    Acterna Jan 1998 - Jan 2001
    Liaison, Validation for products designed by San Diegodivision. This includes PCB and Final assembly, Test, and checking compatibility of firmware with Software.Developed processes for advanced/new technologies. Performed new equipment acceptance testing.Set up SPC system in PC Assembly and Final Assembly areas.Brought new products with fine pitch components to the same DPMO level as other products.Halved production defects every year.
  • Michael Mindel
    Self Employed Consultant
    Michael Mindel Apr 1996 - Jan 1998
    Consulting in electronics manufacturing, electronics packaging, process capability/validation design for manufacturability and Factory Data collection.
  • Rca/Ge/Thomson Consumer Electronics
    Senior Member Engineering Staff
    Rca/Ge/Thomson Consumer Electronics Apr 1984 - Apr 1996
    International Supplier Quality, vendor audits and approval, materials qualification, approval for soldering materials..Failure analysis of solder joints, molded plastic and other miscellaneous parts.Advanced Process Development including process capability/validation on new products to ensure manufacturing compatibility. Process development for new electronic packages.Saved $2.5M annually by rewriting solder specifications to use recycled solder. Converted wave soldering lines World-Wide to no-clean low residue wave soldering. Lead continuous soldering improvement effort using technique of evolutionary optimization. Lead team producing low cost remote control, including developing PCB technology for carbon contacts which is the current world-wide standard.Proved there was a process for wave soldering with lead free solder for EIA consortium.Developed new method of rheological testing screen and stencil printing inks, pastes, and adhesives.Lead international team developing high density very low cost electronic packaging. This includes insulated metal substrate and Low Temperature Cofired Ceramic on Metal technologies.
  • Rca Selectavision Videodisc Operations
    Senior Member Technical Staff
    Rca Selectavision Videodisc Operations May 1975 - Apr 1984
    Design of diamond stylus for capacitive videodisc system. Development of process for sputtering electrodes on diamond. Process development for micromachining 2 micron tip onstylus.Was 1/2 of team that put first microprocessor into a Consumer Electronics product, leading to software patents for tracking correction system which includes look-ahead algorithms still used.Quality and productivity improvement of videodisc cartridge factory. Acting Quality Manager.Set up and maintained SPC in videodisc cartridge factory. Lead continuous improvement teamDesigned and installed custom equipment for metallizing styli. Designed and installed custom equipment for CVD coating vinyl disks with abrasive for shaping of diamonds.Tripled videodisc cartridge testing speeds avoiding over a million dollars in equipment purchases. Developed real-time factory data system for statistical process control of
  • Centre Des Recherches Sur Les Macromolecules
    Scientist
    Centre Des Recherches Sur Les Macromolecules Sep 1972 - Oct 1973
    Study of the thermodynamics of the glass transition in polymers by comparing calorimetric to volumetric measurements. Studying the effect of complex heat treatments upon the physical properties of polymeric
  • University Of Pennsylvania
    Research Associate
    University Of Pennsylvania Sep 1971 - Sep 1972
    Observations of modulus change in polymers with stress via velocity of sound measurements. Creep, recovery and low cycle fatigue studies of polymers to determine deformation characteristics and to delineate deformation modes.
  • Bell Telephone Laboratories, Inc
    Technical Staff
    Bell Telephone Laboratories, Inc Jun 1968 - Dec 1970
    Introduced Ti-Pd-Au and Ti-Pt-Au corrosion proof metallization systems.Thin film corrosion, air gap crossovers, filling of drilled vias in ceeramics.Process development and consultant for electronic substrates on Anti-Ballistic-Missile program.

Michael Mindel Skills

Spc Lean Manufacturing Process Engineering Continuous Improvement Data Collection Soldering Electronics Packaging Process Modeling Process Optimization Apqp Supplier Quality Fmea Doe Ppap Quality Systems Ts16949 Design Of Experiments Root Cause Analysis Dmaic Smt Manufacturing Engineering Minitab Quality Management Cost Reduction Electronics Design For Manufacturing Quality System Engineering Failure Analysis Product Development Testing Manufacturing Six Sigma Quality Control Process Simulation

Michael Mindel Education Details

Frequently Asked Questions about Michael Mindel

What company does Michael Mindel work for?

Michael Mindel works for Indiana Tech

What is Michael Mindel's role at the current company?

Michael Mindel's current role is Adjunct Faculty.

What is Michael Mindel's email address?

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What is Michael Mindel's direct phone number?

Michael Mindel's direct phone number is +131760*****

What schools did Michael Mindel attend?

Michael Mindel attended University Of Pennsylvania, Northwestern University.

What skills is Michael Mindel known for?

Michael Mindel has skills like Spc, Lean Manufacturing, Process Engineering, Continuous Improvement, Data Collection, Soldering, Electronics Packaging, Process Modeling, Process Optimization, Apqp, Supplier Quality, Fmea.

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