Michael Smith Email & Phone Number

Responsible for designing, building, and documenting Data Acquisition Systems for the Navy’s small scale model.

Site product test engineer responsible for defining the system architecture and documenting the electrical and mechanical requirements and software interfaces for test equipment. Responsible for the design of cable harnesses and test fixtures for thermal, thermal vacuum, and vibration. Involved in designing, assembling, debugging, and maintaining test equipment to test the deliverable space electronic assemblies. Lead mechanical engineer responsible for mechanical designs and printed circuit board designs for space and military electronics. • Reduced test equipment schedule time by simplifying and standardizing the design and leading a team that simplified the build process. Achieved a thirty-five percent reduction in schedule for producing test equipment and fixtures. Received customer award for reducing schedule time on test equipment for a critical program.• Lead mechanical engineer for space single-board flight computers, responsible for the mechanical design and printed circuit board layout. Two of the flight computers went in the Mars Curiosity Rover, which successfully navigated to and landed on Mars. • Led a mechanical and electrical design team, in different states, to design a large complex high power water-cooled dense power supply assembly and a servo amplifier and power supply assembly for military application. Reduced schedule time, through individual effort and collaboration with manufacturing. Received award for meeting a critical delivery date, on a technically challenging, and very aggressive schedule.

Lead engineer for site printed circuit board design group. Responsible for mechanical layout, component lead form definition, thermal and structural features, board layers, trace width and spacing, and safety and electromagnetic interference requirements. Developed new processes for new technologies for printed circuit board designs. Developed new processes for manufacturing for product improvements. •Designed and assisted in setting company guidelines for high speed, high density, multilayer printed circuit boards, active backplanes, passive backplanes, and flex circuits, using through-hole, blind-via, layer-via, stacked-via, and micro-via for commercial, military, and space applications. Guidelines produced repeatability and reduced design time and errors.•Established printed circuit board electromagnetic interference guidelines to control crosstalk and noise in high speed electronics. Guidelines eliminated board noise.•Led a team creating the site standard for electrical and printed circuit board library parts. Libraries streamlined the design process and reduced errors leading to a better product.•Lead designer for printed circuit boards, responsible for mechanical designs, component symbols, layouts, routings, and manufacturing documents and data. Printed circuit boards were successfully built without any board design problems.•Created site measuring process by researching equipment, recommending, implementing, programing, and running the site Coordinate-Measuring Machine (CMM) to verify the dimensions on deliverable parts. This process improvement resulting in reducing the measurement verification time from six hours down to five minutes per part.•Lead low-voltage power supply mechanical engineer and printed circuit board layout engineer for the F-22 Raptor fighter aircraft. Power supplies were successfully manufactured and qualified on the first build without any rework, ground-loop noise, or EMI problems.

Responsible for printed circuit board designs, mechanical designs, and cable designs.•Mechanical engineer for the Navy’s Acoustic Rapid Commercial-off-the-shelf Insertion (A-RCI) Multi-Purpose Processor (MPP). Responsible for designing the cable harnesses and the mechanical packaging of the electronics and power supplies. All parts worked as designed without any problems. •Designed complex cable harnesses for a unit in the Navy’s Virginia class (SSN 774) new-attack submarine. Cable worked without any fit or noise problems.

Responsible for designing printed circuit boards for space and Navy systems. Responsible for creating printed circuit board guidelines for the mechanical, electrical, and printed circuit board design groups. Developed printed circuit board layout and routing procedures for high-speed digital signals. Developed board layout guidelines for analog board designs. Developed safety guidelines for high voltage and high amperage power boards. Guidelines produced successful board designs.

Lead mechanical designer responsible for the mechanical design of the Acoustic Transmitter Unit (ATU) used on sonar system AN/BSY-2 for the Seawolf class (SSN 21) fast-attack submarine.•Created the design concept for the ATU and led a design team in the design and documentation of the unit. The ATU was finished on schedule. •Developed a new EMI / environmental gasket working with a gasket vendor. ATU past the spray test and drip test on the first pass.•Designed the ATU structure, cold plates, and piping. Assisted in designing noise isolation to prevent transformer acoustical noise. Fit and design checked all detail parts and cables from team members. ATU went together without any issues and passed shock and vibration testing.•Designed installation fixtures and presented a presentation to the Navy on how to install the ATU onboard a submarine. The ATU was installed without any problems.

Lead mechanical designer responsible for creating and supporting the mechanical design and build of units that makeup the Navy’s AN/BQQ-5, AN/BQQ-6, and AN/BSY-1 submarine sonar programs. •Responsible for the mechanical design and cable harness design for two units in the AN/BSY-1 sonar system. Also support the build process through to qualification testing. Units were built and qualified successfully without any problems.•Responsible for implementing the updates in the mechanical design with each upgrade to the baseline of the AN/BQQ-5 system. Mechanical design of the system was updated to make hardware changes on the submarine easier to upgrade.•Responsible for creating the mechanical design and instructions for sonar upgrade kits, refurbish kits, and retrofit kits to maintain sonar units on the following classes of submarines, Sturgeon class (SSN 637) fast-attack, Los Angeles class (SSN 688) fast-attack, and Ohio class (SSBN 726) ballistic. The kits made the modifications to the system fast and efficient.•Responsible for the design and build support of the water-cooled and air-cooled versions of the AN/UYS-1 Advanced Signal Processor (ASP). The ASP is used on the USAF Mobile Ground Terminal (MGT), the P-3 Orion, Light Airborne Multipurpose System (LAMPS) helicopter, and Tri-ASP for the Navy’s submarine programs. The units were successfully built and delivered.

Responsible for designing and documenting ASME pressure vessels, piping, heat exchanges, and tanks used in chemical plants and oil refineries. Assisted in setting up the x-ray machine, x-raying, developing x-ray films, and interpretation of film. Supported fabrication through to final delivery.

Bachelor Of Science, Electrical Engineering

Associate Of Applied Science, Mechanical Design Drafting

Associate Of Applied Science, Mechanical Engineering Technology