Ryan Kim Email & Phone Number

Glendale, KY, US

• Process optimization for new modules (NPI, MP): Analyzed the root cause of defects: Proceed process design of experiment (DOE) to improve defects using JMP and Minitab: Optimized for SMT tools (Mask, Carrier, Magazine).
• Prevent mass defects in advance: Failure analysis and corrective action (FACA): Eight disciplines problem solving (8D): Standard operating procedure (SOP)
• Set up the SMT line at the new factory site (Paju City, South Korea): Substrate Pick and place (PnP), Screen printer, Solder Paste Inspection (SPI), Chip mounter, Reflow, Laser marking, Automated optical inspection (AOI)
• Innovative cost reduction for raw materials (Deflux Cleaner): Discover new vendors, Reduce usage, and improve management
• Application of new function: Multi-functional transfer unit for package-on-package (PoP): Vacuum feeder for chip mounter

South Korea

• Development of Smaller RF Components: Reviewed ways to reduce chip size to miniaturize the product: Optimized packaging processes to overcome substrate tolerance.
• Development of Thinner RF Components: Improved packaging processes to use thinner PCB.
• Development of Automotive RF Components (For telemetrics): Improved packaging processes to overcome cavity package camber.: Analyzed metal shield products using sputtering process. (automotive electronics reliability.
• Revision of packaging design rule for model development.

South Korea

• Supported new business and academic research