Director Of Photonics Outreach
Current-Analyze market landscape for strategic positioning and technical road-mapping.-Emphasize AIM Photonics' competitive advantage through differentiation in layer stack, advanced packaging capabilities, sub-system products, and PDK components.-Design silicon photonics circuits & TSV-interposer interconnection for 2.5D Co-Packaged Optics chiplet (drivers, TIAs, and DSPs) IMDD transceiver system demonstrator/reference design.