Advanced Technology- Devote to 3DIC (3D V-Cache) new product introduction, pre-ramp up and mass production.- Drive 3DIC (3D V-Cache) technology yields improvement and new factory readiness.

Advanced Technology- Develop, qualify and deliver industry's first 3DIC (3D V-Cache) product to the market.- Dedicate to 3DIC (3D V-Cache) process integration, qualification and production.

Advanced Technology- Develop, qualify and deliver industry's first EFB (Elevated Fan Out Bridge) product to the market.- Commit packaging process integration & execution for multiple cutting-edge packaging projects including 3DIC, EFB, Wafer Level Fan-Out and advanced wafer node CPI validation.

New Technology Management (NTM) – Packaging Engineer- Integrated Fan-Out Wafer Level Package (InFO) development. Focus on chip last process flow with heterogeneous integration for application processor of HPC.- Modules-integration: hands-on experience and tooling expertise:- Flip-Chip bonding: fine pitch (<40um) die attach (Shibaura TFC-6000); flux selection (jetting/dipping); reflow profile fine-tune and scaling design.- RDL processing: deliver plating/stripping/etching process BKM for fine width/pitch Cu line (2um/2um) with yield >99.5%.Special Turnkey Program (STP) – Packaging Engineer- N16/N10 advanced IC package development (FCCSP; WLCSP; SiP) for consumer electronics Global Tier1 customer: OSATs management crossing Taiwan, China and Korea.- Deliver ultimate tiny & thin (50um) deep trench IPD package to mass production: bumping; wafer backside grinding; die saw (DRIE; DBG; stealth dicing) and packing (TnR).- Co-develop foremost pick and place tool with 6s inspection & FT electrical tester: tools ability evaluation; visual inspection criteria draw-up and mass production implement.

- N20 PVD process engineer