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Patrick Cheng is listed as Senior Member Of Technical Staff Packaging Engineer at AMD, a with 16705 employees, based in Taiwan, Province of China. AeroLeads shows a matched LinkedIn profile for Patrick Cheng.
Patrick Cheng previously worked as Member Of Technical Staff Packaging Engineer at Amd and Sr. Packaging Engineer at Amd. Patrick Cheng holds Master Of Science - Ms, Materials Science And Engineering from Texas A&M University.
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Deliver multiple products with advanced package platforms from path finding development to high volume production including 3DIC (3D V-Cache); 2.5D (CoWoS-S/R/L, EFB (Elevated Fan Out Bridge), Wafer Level Fan-Out (InFO-oS/PoP) and CPI (Chip Package Interaction). 10+ years experienced in project management: design rule extension; technical risk assessment; process flow build-up; trouble shooting; BOM selection; failure analysis, package qualification & mass production. Global Tier 1 subcons management: close collaboration and deep relationships with Fab, OSATs, tool vendors & materials suppliers crossing US, Taiwan, China and Korea. Highly motivated and enthusiasm team player for solving technical issues with fluent bilingualism communication.
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Taiwan
Advanced Technology- Devote to 3DIC (3D V-Cache) new product introduction, pre-ramp up and mass production.- Drive 3DIC (3D V-Cache) technology yields improvement and new factory readiness.
Taiwan
Advanced Technology- Develop, qualify and deliver industry's first 3DIC (3D V-Cache) product to the market.- Dedicate to 3DIC (3D V-Cache) process integration, qualification and production.
Taiwan
Advanced Technology- Develop, qualify and deliver industry's first EFB (Elevated Fan Out Bridge) product to the market.- Commit packaging process integration & execution for multiple cutting-edge packaging projects including 3DIC, EFB, Wafer Level Fan-Out and advanced wafer node CPI validation.
Taiwan
New Technology Management (NTM) – Packaging Engineer- Integrated Fan-Out Wafer Level Package (InFO) development. Focus on chip last process flow with heterogeneous integration for application processor of HPC.- Modules-integration: hands-on experience and tooling expertise:- Flip-Chip bonding: fine pitch (<40um) die attach (Shibaura TFC-6000); flux selection (jetting/dipping); reflow profile fine-tune and scaling design.- RDL processing: deliver plating/stripping/etching process BKM for fine width/pitch Cu line (2um/2um) with yield >99.5%.Special Turnkey Program (STP) – Packaging Engineer- N16/N10 advanced IC package development (FCCSP; WLCSP; SiP) for consumer electronics Global Tier1 customer: OSATs management crossing Taiwan, China and Korea.- Deliver ultimate tiny & thin (50um) deep trench IPD package to mass production: bumping; wafer backside grinding; die saw (DRIE; DBG; stealth dicing) and packing (TnR).- Co-develop foremost pick and place tool with 6s inspection & FT electrical tester: tools ability evaluation; visual inspection criteria draw-up and mass production implement.
Other employees you can reach at amd.com. View company contacts for 16705 employees →
Alexander Kranias
Colleague at AmdGreater Tampa Bay Area, United States
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JC
Junshu Chen
Colleague at AmdAustin, Texas, United States
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YC
Yan Chen
Colleague at AmdSingapore
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TH
Tatum Hartwig
Colleague at AmdAustin, Texas, United States
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CM
Cameron M.
Colleague at AmdBerala, New South Wales, Australia
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DM
Dianna Maurer, Pmp
Colleague at AmdAustin, Texas, United States
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VM
Virupaksha Math
Colleague at AmdBengaluru, Karnataka, India
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IM
Iulia Miruna Tiliute
Colleague at AmdRichmond Hill, Ontario, Canada
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CF
Carlos Fernando Agapito Dos Santos
Colleague at AmdRio De Janeiro, Brazil
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MI
Muhammad Islam
Colleague at AmdDubai, United Arab Emirates
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Quick answers generated from the profile data available on this page.
Patrick Cheng works for AMD.
Patrick Cheng is listed as Senior Member Of Technical Staff Packaging Engineer at AMD.
Patrick Cheng is based in Taiwan, Province of China while working with AMD.
Patrick Cheng has worked for Amd and Tsmc.
Patrick Cheng's colleagues at AMD include Alexander Kranias, Junshu Chen, Yan Chen, Tatum Hartwig, and Cameron M..
You can use AeroLeads to view verified contact signals for Patrick Cheng at AMD, including work email, phone, and LinkedIn data when available.
Patrick Cheng holds Master Of Science - Ms, Materials Science And Engineering from Texas A&M University.
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