- six sigma green belt graduation.- 2021 annual PMD was “out of standard”.- 2017 annual PMD was “out of standard”.- 2019 Vanguard FAB2 CIT (continual improvement team) competition winner.- 2020 Vanguard BKM (Best Known Method) innovation award TOP5.- Co-worked with PIE to reduce product defect occurred and procedure robust.- Wafer backside discolor issue, found solution and transfer knowledge to other FAB.- By shortening 40% process time, improve production efficiency. - Department meeting leader, control and improvement department KPI from over FAB target 1.8 time reduced to met FAB target.- FAB control wafer meeting owner : Raised control wafer reuse rate ~30% and reduced cost 100K / pre-year.- CO2 second source full release at FAB tools. Benefit : 243K / pre-year.- Process optimize :(1) Modified recipe parameter to reduce defects happened, CP yield improved 1~2%.(2) By changed recipe body to reduce defect remained, highlight count from 3~5/month to 0~1/month.(3) Control wafer process flow optimized, reduce cycle time 50%.(4) Reduced process time to increase back side etching WPH 6%.(5) PR strip recipe merge increase tool capacity 6~8%.(6) Implant tool total output rised 17~19%.(7) Recycle tools transformation, wafer scrap rate from 75% trend down to 15%.Responsible for CIT project :(1) Measure tool capacity improved, saving 4,000,000 NTD per year.(2) Wet bath PR strip tools WPH raised 10 ~ 50%, gain 9,500,000 NTD per year.

Epitaxy R&D Engineer- Fine-tuned EQP parameters by SPC chart results and kept product yield above 99%.- Developed of new epitaxy recipe and improved existing recipe to upgrade product performance.Chip Process Development Engineer- Developed new Flip Chip process and transferred relevant process to FAB.- Modified products structures to reduce chip costs by 16%.- Increased LED luminance 4% by adjusted ITO film process.