Philip Campbell Email and Phone Number

• Sustained inline defect metrology tools in support of high-volume wafer manufacturing• Developed scripts for automated data analysis using Python, MATLAB, and JMP• Implemented novel defect metrology solutions for inline capture of new defect modes in multiple areas of the process flow (FEOL, BEOL, Packaging)• Managed projects with suppliers to scope requirements for new generations of defect metrology tools, and coordinate the install and implementation of those tools for high-volume manufacturing

- Synthesis and physical characterization of 2D thin films, with an emphasis on large-area uniform growth methods compatible with high-volume manufacturing- Device fabrication and electrical characterization of thin films to measure properties such as field-effect mobility and defect densities- Simulation of 2D vertical heterostructures to understand device performance tuning and the influence of defects and impurities on the device behavior- Worked to establish a link between physical characterization of 2D materials and corresponding electrical performance

- Investigated sputtering of mixed-composition metal oxide thin films- Characterized films based on surface analysis techniques, including Auger Electron Spectroscopy (AES), X-ray Photoelectron Spectroscopy (XPS), Atomic Force Microscopy (AFM), and X-ray Diffract (XRD)- Interpreted data to make recommendations about future paths for experiments and development