Richard Ackerman
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Richard Ackerman Email & Phone Number

Location: Vancouver, Washington, United States 6 work roles 2 schools
1 work email found @mentor.com LinkedIn matched
✓ Verified July 2026 4 data sources Profile completeness 71%

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Location
Vancouver, Washington, United States

Who is Richard Ackerman? Overview

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AeroLeads shows a work email signal at mentor.com and a matched LinkedIn profile for Richard Ackerman.

Richard Ackerman previously worked as Corporate Applications Engineer at Mentor Graphics and Director of Operations at Teseda Corporation. Richard Ackerman holds Msee, Electrical Engineering from Oregon Health & Science University.

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About Richard Ackerman

Throughout my 20+ year career in semiconductor and software development I have been recognized for driving quality improvements in the products delivered and the processes used to develop them. I have a proven track record of working with domestic and international customers to thoroughly understand their application and its requirements and then collaborating with engineering teams to develop products that meet the needs of the broader market. I am committed to delivering the highest quality products to the customers while minimizing the costs to do so. KEY STRENGTHS:• Cross-Functional Project Management• Product Management• Client Relationship Management• Requirements Gathering• Manufacturing Operations• Quality Management• Solutions Development• Process Improvement • Troubleshooting• Customer Training • ATE Test development• Failure Analysis • Yield ManagementCORE COMPETENCIES:CUSTOMER APPLICATIONS MANAGEMENT – Extensive experience finding creative solutions to meet a customer’s specific needs by tailoring products, training, and evaluation criteria to meet their needs and highlight the results achieved. Proven ability to communicate the value to all levels of management at customer locations.PRODUCT OWNERSHIP – Proven track record of defining new products and product enhancements and then leading their development including defining market requirements, user interface specifications, success criteria, test plans, documentation and developing marketing materials. PRODUCT ENGINEERING AND TEST DEVELOPMENT – Successfully led integrated circuit test development projects from DFT design through mass production release including first-silicon debug, developing high quality test programs, performing detailed characterization, and accelerating initial yield ramp.INTERNATIONAL EXPERIENCE – I have led many projects and customer engagements in Japan, Korea, Taiwan, Ireland, Scotland, Belgium, Austria, Italy, France, Israel, and Turkey.

Listed skills include Semiconductors, Dft, Testing, Debugging, and 19 others.

6 roles

Richard Ackerman work experience

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Director Of Operations

Teseda Corporation

Portland, Oregon Area

Fully responsible for managing the development, manufacture, delivery and support of all Teseda Products. These responsibilities include managing contract design engineers, contract layout engineers, internal software and firmware engineers, contract manufacturing, product rollout and customer communications. • Manage roadmap for Teseda’s software and hardware products.• Work directly with customers and sales personnel to define and manage products that meet or exceed the customers’ requirements.• Develop and deliver training to new customers to enable them to achieve high levels of success using Teseda’s products. • Manage contract hardware designers to develop new components that add value to the Teseda V550 product offerings

Jun 2011 - Apr 2014

Quality Manager

Lake Oswego, Or

At Bizbuilt, I had the opportunity to establish the culture of quality and high coverage test from the very beginning. By challenging the team to write tests that cover every line of code, we accomplished two key benefits. First, we had very few regressions which led to more efficient development. Second, we had a more robust architecture because by making the product easier to test, they made it easier to maintain.• Managed content and quality of Bizbuilt web application releases.• Defined user experience for new business social media web application that met the needs for simplicity and capability for a wide range of customers.• Managed the test requirements to achieve high coverage of the code base for the Bizbuilt web application.• Managed and measured code against known best practices to ensure a high quality and maintainability of the code base to ensure a high pace of development can be maintained long term.

May 2010 - Jun 2011

Product Manager

Teseda Corporation

Portland, Or

• Facilitated communication between the engineering teams, field personnel, and customers to define new functionality or improve existing functionality for the users. • Defined new products that help customers solve customers’ problems and expand market presence. • Defined product roadmaps for Teseda Workbench and Diagnostic Manager products. • Build demonstrations that illustrate the value of our products to potential customers. • Built partnerships with companies who provide complimentary products to provide greater benefit to customers by leveraging the strengths of both companies.

May 2008 - May 2010
2 education records

Richard Ackerman education

Msee, Electrical Engineering

The Oregon Graduate Institute of Science and Technology merged with Oregon Health and Science University in 2003.

FAQ

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What is Richard Ackerman's email address?

AeroLeads has found 1 work email signal at @mentor.com for Richard Ackerman.

Where is Richard Ackerman based?

Richard Ackerman is based in Vancouver, Washington, United States.

What companies has Richard Ackerman worked for?

Richard Ackerman has worked for Mentor Graphics, Teseda Corporation, Bizbuilt, Inc., and Sharp Microelectronics Of The Americas.

How can I contact Richard Ackerman?

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What schools did Richard Ackerman attend?

Richard Ackerman holds Msee, Electrical Engineering from Oregon Health & Science University.

What skills is Richard Ackerman known for?

Richard Ackerman is listed with skills including Semiconductors, Dft, Testing, Debugging, Electronics, Soc, Ic, and Test Engineering.

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