Richard Baggaley
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Richard Baggaley Email & Phone Number

Senior Mechanical Engineer at Xavveo
Location: Berlin Metropolitan Area, Germany 11 work roles 2 schools
1 work email found @verifone.com LinkedIn matched
✓ Verified Jul 2026 4 data sources Profile completeness 100%

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Current company
Role
Senior Mechanical Engineer
Location
Berlin Metropolitan Area, Germany
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Who is Richard Baggaley? Overview

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Richard Baggaley is listed as Senior Mechanical Engineer at Xavveo, a with 16 employees, based in Berlin Metropolitan Area, Germany. AeroLeads shows a work email signal at verifone.com and a matched LinkedIn profile for Richard Baggaley.

Richard Baggaley previously worked as Senior Mechanical Engineer at Ospin Gmbh and Mechanical Engineer at Softiron. Richard Baggaley holds Beng, Mechanical Engineering from The Open University.

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Email format at Xavveo

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Profile bio

About Richard Baggaley

I am a born engineer. From a very young age helping (in my mind) my father restore a collection of Austin Minis to all of my free time being consumed with engineering based activities.This excitement and passion for engineering and learning has been echoed throughout my career since 18 years old. Always a desire in my conscience to produce the best possible products for the desired pricing, timing and manufacturing specifications. This has often lead to me learning the very latest in techniques and materials, such as being one of the first to experiment in the development of transparent conductive capacitive sensors through to converting a concept model of an antenna into the worlds first truly quad band internal cell phone antenna able to be manufactured in the millions.I never rest when it comes to expanding my knowledge and experience and this always benefits my employers as i also believe in sharing my knowledge and experience freely with others.These attributes and my general nature and ability to speak easily to non engineers, have allowed me the excitement of working around the world from Mexico City, Israel and Thailand to China and extended periods in the U.S.A.

Listed skills include Development Tools, Engineering, Assembly, Wireless, and 7 others.

Current workplace

Richard Baggaley's current company

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Xavveo
Xavveo
Senior Mechanical Engineer
Berlin, DE
Website
Employees
16
AeroLeads page
11 roles

Richard Baggaley work experience

A career timeline built from the work history available for this profile.

Senior Mechanical Engineer

Berlin, De

Senior Mechanical Engineer

Berlin, Germany

Mechanical Engineer

Berlin, Germany

Apr 2021 - May 2023

Senior Mechanical Engineer

Amphenol Saa

Neu Anspach (Frankfurt)

A new office for Amphenol SAA (Shanghai Amphenol Airwave) in the Frankfurt region concentrating on design, development and production of the very best in automotive antennas.Responsible for initialising the mechanical design/engineering facility from CAD data (Catia as standard NX for certain customers) storage and protection, Workshop equipment, machinery, training and safety.Direct supplier interaction in Europe and predominantly China for prototype parts and the planning, quality controls and costing of mass production tooling and parts.Wrote and implemented company wide physical security procedures and system to adhere and maintain VW lead industry standard security standards. 95% acceptable at first audit which was applauded by the auditor. Along with the administration responsibilities i also take care of part testings (physical), testing of prototype builds (which can include scratch build in house parts and assemblies) on prototype vehicles borrowed from Germany and Europe's major motor manufacturers.I am also direct customer facing engineer, meeting with Germany's and other European leading motor manufacturers. My role is to assist sales with technical support, Answer questions from the OEM. I also write and present project updates and RFI/RFQ (Request For Information/Request For Quote) presentations for these manufacturers.

Jan 2017 - Nov 2020

Senior Mechanical Engineer

Bad Hersfeld, Hessen, Germany

Employed to design industrial die-cast and injection molded enclosures for very high security chip and pin payment machines using Solidworks.The majority of projects included the design of high pressure die-castings capable of exceeding multiple IK09 impact and tamper-triggers capable of destroying secure "key codes" used in card payments at any ingress of the housing.Along with the die-cast fascia i also designed complicated plastic injection molded enclosures which protected the electronics from the environment (moisture, water, wide temperature range e.t.c.) These plastic enclosures also has the tamper-triggers to detect an attempt to access the secure data within and then to trigger the "self destruct" function of the secure key generator within.Products included hybrid magnetic strip, contactless, and chip and pin payment machines. Unattended card readers destined for ATM and parking lots. Plus a new product incorporating vandale resistant enclosures for a complete suite of payment apparatus for Gilbarco Veeder-Root fuel pumps.Along with the regular design work i also attended many site and customer visits around the world working with customers on their integration with our products, writing installation instructions and validation plans.

Sep 2013 - Dec 2016

Mechanical Engineer

Cambridge, United Kingdom

Employed as level 2 consultant engineer. Sagentia is a well known Cambridge and Boston based design consultancy.My role as a level 2 engineer was to take care of my own project work and also advise/guide the more junior engineers in their project work.As such my main project was to create a machine capable of chilling water fast and injecting this water into a carbonating device, add syrup and produce ice cold beverages at home.Primarily my area of concentration was the injection molded disposable "pod" design (containing the carbonation process and syrup) and the design of the enclosure around the pressurised (5 bar) pod.My designs included die-cast and injection molded parts to enclose and withstand the internal pressure of 5 bar and then with the CO2 withdrawn, the vacuum left. This had to be completed with the consideration of human interruption and power failure (for safety).Secondary design responsibilities was with the water chiller/chamber with was for thermal and cost reasons extruded aluminium. This devise had to be tested with various food safe coatings to prevent corrosion but remain with a volume of chilled water within for extended periods of time. The extrusion was the simple part. The food safe (FDA approved) coating and keeping within budget was the difficult aspect. PTFE impregnation was the best and agreed option and this aspect of the design remained unchanged for mass production.Ultimately the design of the pod and head area surpassed the test requirements under budget however the customer preferred a model in line with their corporate ID. This model of drinks machine was sold as the "Keurig Kold"...Before i am asked...I was asked to make it work...Not if it would sell :)

Jan 2013 - Aug 2013

Mechanical Design Engineer

Cambridge, United Kingdom

Domino are one of the worlds leading industrial printer manufacturers and at my time with Domino was required to take an ailing, costly and inefficient design of ink ribbon printer used on the food and medical industries (packaging) and bring the cost down, maintenance interval increased, make it quieter and an overall refresh.I designed a chassis that initially was intended to be machined but sales forecast exploded therefore changes where made to allow this to me die-cast with minimal post machining. The chassis would hold 4 stepper motors which would drive the ribbon (in a patent protected economically way) the head movement across the print area and the print head up and down. Bearings where required as where linear rails for precision of print.Alongside the diecast chassis there was PCB integration and an injected molded cover for these electronics. The ribbon and mechanism was covered in a separate removable large, deep, thin walled injection molded cover. The rear panel with connections was a sheet metal pressing.Secondary to the printer itself i designed the enclosure for the SBC (Single board computer) and touch screen (resistive) which would accompany either one or as it was "hot swap" many printers. This touch screen module had to be EXTREMELY cheap (it was an afterthought with zero budget) and rugged as it was to live and be passed around a factory floor. After design work i devised and wrote a test plan including accelerated life cycle. Chaired FMEA and presented the results to the Domino board.After many months of testing the design was sealed and the product has been welcomed into the market very well. Domino won design and innovation awards for this product too.

Aug 2010 - Dec 2012

Mechanical Deisgn Engineer (Contract)

Ely United Kingdom

For Thorlabs I was tasked with the design and development of a rapid change filter wheel designed to fit high end optical microscopes (Predominantly Nikon).This filter wheel was to switch between filters in under a second and at the touch of a button.Low volume manufacture allowed a simple machined and coated Aluminium enclosure however the smooth and precise operation of the filter switching was paramount. I decided the best way to accomplish this was with a precise stepper motor with inbuilt driver.At the end of my contract period the prototypes had been validated and moving onto production ready by colleagues in New Jersey.Alongside my design role for Thorlabs I was also requested to bring some maturity and experience to the very young team. I often advised them on best practice, the choosing of manufacturing process and materials and the generation of test and validation plans.

Apr 2009 - Aug 2010

Senior Mechanical Engineer

Cambridge, England, United Kingdom

Employed to design the next generation 19" rack mounted base-station for Zinwaves RF to optical transformer. Company desire was for something completely unique and not sheet metal. We had a plan to make the base-station modular allowing options as to which mode of input and or output where desired.With const considerations in mind (part and tooling) i chose to go with an extruded aluminium system allowing us the freedom to make up a base-station with between one and eight input modules on the front and one and four output on the rear.Standard sheet metal enclosed the top and base of the base-station and some wild colours where chosen (by marketing) for the modules.The base-station internals where critical to operation and these included a self designed PSU (Extremely low noise) fibre optic pathways and teminations, RF amplification and regular power network. The products took RF from the outside world through an antenna and module into the base-station where is was converted to a fibre optic signal. This signal was then through an output connected to a buildings fibre optic network and transmitted many hundreds of metres throughout the building. This was then attached to our planned remote module which converted it back to RF and broadcast through our antenna.Some early success (after the events of Sept 11th) was seen but only with RF amplification options. The optical conversion and re-conversion option was not in high demand.We had units installed in two MLB stadiums and one high rise building in the USA. Sadly the VC funding dried up and Zinwave struggled on with no engineering resource.

Jan 2007 - Mar 2009

Senior Mechanical And Sensor Designer

Cambridge, England, United Kingdom & San Jose, California

I was unique within Synaptics 300 Employees and 4 global offices as the only Mechanical and electronics designer. From the customer requirements i would create my initial mechanical design. This was then in cooperation with the customers design team assembled and agreed upon or revised.Once agreed i would design the sensor PCB and electronics according to my Synaptics training and once the complicated and bespoke process was completed i would pass the design onto the firmware engineers.To accompany my sensors i would often design the fastening method into the customers product. This could be a separate injection molded part, a single or dual shot light pipe and/or direct design into their product dictating their tooling requirements.I had sensor designs in Apple Ipods, Creative MP3 players, Samsung, Nokia and LG cell phones and many, many more.Alongside my design role i also began to document the Synaptics design rules and process' which up until that point had not been written down. From this grew an internal project to standardise the PCB tools and libraries across the globe and improve our in house (capacitive) simulation tools. This project was an attempt to increase our first spin pass rate on our sensors which although common place now where still in their infancy in the early 2000's.My work was split 60/40 between Cambridge UK and San Jose California. So much so i had a permanent residency in San Jose for six months in 2006. Along with project work i was also tasked with managing the 10 strong PCB design team in San Jose due to their manager requiring an extended period of leave. I was removed from project work and spent six weeks as a full time manager of the engineers.Sadly Synaptics decided a specialised office in the UK for next generation products and tackling the obscure and difficult projects was not warranted and closed the office in late 2006. Due to relationship reasons i rejected an offer of full relocation to San Jose.

Jun 2004 - Dec 2006

Design Engineer

Cambridge, England, United Kingdom

As a start-up, i began the design office for Antenova and began bringing in design rules for their RF team.I was responsible for all of the mechanical designs for Antenova from PCB's, housings and fastenings to ceramic antenna components.We spent a lot of time experimenting as this was completely new technology and eventually we one our first product win which was a clip in antenna for Motorola.This design was for a small injection molded "carrier" which would snap into the cell phone chassis and be retained through drop testing and attempted vandalism.The carrier had a small ceramic chip inserted in the underside and heat staked in, then a small folded sheet metal contact pin was press fitted between the carrier and ceramic. This was the RF feed to the motherboard of the cell phone.On the flip side of the device a complex folded and curved sheet metal parasite antenna was heat staked into position with another "leg" dropping to the underside and grounding on the phones motherboard.This antenna was credited as the worlds FIRST internal cell phone antenna capable of quad band coverage and was fitted into the Motorola A780 phone.

Feb 2002 - May 2004
2 education records

Richard Baggaley education

National Certificate, Mechanical And Production Engineering

West Suffolk College
FAQ

Frequently asked questions about Richard Baggaley

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What company does Richard Baggaley work for?

Richard Baggaley works for Xavveo.

What is Richard Baggaley's role at Xavveo?

Richard Baggaley is listed as Senior Mechanical Engineer at Xavveo.

What is Richard Baggaley's email address?

AeroLeads has found 1 work email signal at @verifone.com for Richard Baggaley at Xavveo.

Where is Richard Baggaley based?

Richard Baggaley is based in Berlin Metropolitan Area, Germany while working with Xavveo.

What companies has Richard Baggaley worked for?

Richard Baggaley has worked for Xavveo, Ospin Gmbh, Softiron, Amphenol Saa, and Verifone.

How can I contact Richard Baggaley?

You can use AeroLeads to view verified contact signals for Richard Baggaley at Xavveo, including work email, phone, and LinkedIn data when available.

What schools did Richard Baggaley attend?

Richard Baggaley holds Beng, Mechanical Engineering from The Open University.

What skills is Richard Baggaley known for?

Richard Baggaley is listed with skills including Development Tools, Engineering, Assembly, Wireless, Manufacturing, Electronics, Simulations, and Mechanical Engineering.

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