Richard Munoz Email & Phone Number

- Principal Failure Analysis Engineer with 20+ years of hands-on experience. - Has solid background and experience in failure analysis of analog, logic, memory, mixed logic, automotive, RF, microcontroller and discrete devices. - Knowledgeable about semiconductor wafer fabrication, assembly and final test processes, PCB manufacturing, surface-mount technology, customer complaint handling, quality assurance engineering and reliability testing and processes.. - Proficient in the operation of various FA equipment which include optical microscopes (Sony, Nikon, Olympus), x-ray (Phoenix, YXLON Cougar), SAM (Sonix, PVA TePla), curve tracer (Tektronix), semiconductor parametric analyzer and device analyzer (HP, Agilent), device characterization (Keithley), SEM/EDX (Jeol, Hitachi, Karl Zeiss), microprobe station (Karl Suss), PEM/OBIRCH (Hamamatsu), RIE (NSC, Nordson), cross-sectioning equipment (Allied), automatic decapsulator (Nisene), laser decapsulator (Digit Concept, NSC) and bench test equipment (Agilent, Keithley). - Highly knowledgeable in die deprocessing techniques using chemical etchants and reactive ion etchant. - Works and interacts with different manufacturing and support groups for investigation and resolution of internal issues (production failures, Reliability qualifications, engineering evaluations) and external issues (customer returns, warranty returns).- Hands-on experience in soldering and desoldering procedures

Listed skills include Failure Analysis, Semiconductors, Ic, Semiconductor Industry, and 15 others.

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  De La Salle University

  B.S. Electronics And Communications Engineering