Quality and Reliability: Extensive experience in package failure analysis with a proven track record of building strong relationships with internal and external customers. Highly motivated professional with the ability to blend technical knowledge with excellent communication and interpersonal skills. A key problem solver with a talent for recognizing opportunities and producing results. Team oriented participation in the decision-making process of the design of experiments. Trained and certified on high end FA/FI tools such as 2D/X-plane x-ray imaging, Dual Beam FIB, SEM imaging/EDS analysis, FIB (single beam), Ion Milling, EOTPR/TDR (time domain reflection), ELITE (lock-in IR thermography), UV Lasers, Acoustic Microscopy, CADNAV, Mentor Graphic Design, Chemical de-processing and Mechanical cross-sectioning.

Assembly Test Development: Supporting multiple package platforms with logistics/tracking of material through high volume manufacturing. Attend daily Mfg OPS for prioritizing lots or for any kitting, DRB’s or yield issues. Create/modify eAPO’s and maintain tracking sheets and die inventory for large Si die. Responsible for yield improvements, modules reject verification and process development. Identify and lead yield improvement teams, interact with Module Engineering groups to resolve yield loss issues. Prepared written reports and presented results to core management team.

Assembly Test Development: Test packaging devices on mobile, server and desktop processors. Provide key technical assistance for ensuring new product introduction and integrity of those product lines. Responsible for lab safety and lab access, as well as training on lab equipment such as Acoustic microscopy, X-ray, Metallurgy equipment, Electrical Tester and DNC milling. Supported the factory floor in identifying electrical failures within various CPU packages, which is crucial for process control. Identified key failures and implemented corrective action by means of laboratory techniques, which include cross sectioning, SEM/EDS, X-Ray, mechanical testing, electrical probing, TDR and microscope inspection.