Rick Lake Email and Phone Number

Advanced Packaging Technology Development (APTD). That's all I will say.

Aptina Imaging was acquired by ON Semiconductor. My responsibilities and job description remain the same.

Broad level charter is to develop processes for fabricating and/or assembling wafer level CMOS image sensors. Processes include wafer-to-wafer or wafer-to-glass bonding using adhesives, photodefinable dry films, and oxide bonding. Wafer level glass attach for both wirebondable or through-silicon-via (TSV) devices. Developed wafer level microfluidic packages with emphasis on image sensors in biological applications. Wafer level alignment of glass-to-silicon. Developed wafer level image sensor lens assemblies using imprint processes. Developed wafer level solder bumping using several solder alloys.

Continued earlier efforts after LightLogic's acquisition by Intel.

Startup company where I was involved in process development for high speed fiber optic telecom equipment. Company was purchased by Intel in June 2001. Developed fluxless soldering of both transmit and receive fiber optic modules using AuGe, AuSn, SAC305, InSn, InSnCd, and BiSn solders in a "step soldering" process using conduction, convection, and induction solder processes.

Lead team in RFID (Radio Frequency Identification) product design and development. Identified equipment required to produce product, wrote equipment specifications, selected equipment and equipment vendors, and procured over $5 million dollars worth of capital equipment. Took product from single engineer development to full high volume manufacturing. Developed continuous roll, screen printed, polymer thick film conductive ink circuitry and conductive epoxy bonded flip chip. Lead effort of 2 PhD polymer chemists to successfully custom formulate both the conductive epoxy and epoxy encapsulant, as there was nothing commercially available that met our needs.

Process development and product design for radio frequecy identification devices.

Surface mount soldering development and support for guidance electronics of Stinger and Stinger RMP Shoulder Launched Anti-Aircraft Missile System. Transitioned new weapon systems into production. Process development on advanced electronics packaging. Extensive work on the satellite Space Based Interceptors of Ronald Reagan's "Star Wars Program", Brilliant Pebbles. Wrote proposals for new defense weapon related business contracts.