Riley Erickson
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Riley Erickson Email & Phone Number

Packaging R&D Engineer at Intel at Intel Corporation
Location: Greater Phoenix Area, United States 6 work roles 2 schools
1 work email found @intel.com LinkedIn matched
✓ Verified July 2026 4 data sources Profile completeness 86%

Contact Signals · 1 work email

Work email r****@intel.com
LinkedIn Profile matched
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Current company
Role
Packaging R&D Engineer at Intel
Location
Greater Phoenix Area, United States
Company size

Who is Riley Erickson? Overview

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Quick answer

Riley Erickson is listed as Packaging R&D Engineer at Intel at Intel Corporation, a with 10 employees, based in Greater Phoenix Area, United States. AeroLeads shows a work email signal at intel.com and a matched LinkedIn profile for Riley Erickson.

Riley Erickson previously worked as Packaging R&D Engineer at Intel Corporation and Design Engineer at Crafco, Inc.. Riley Erickson holds Bachelor'S Degree, Design Engineering Technology from Weber State University.

Company email context

Email format at Intel Corporation

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{first}.{last}@intel.com
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AeroLeads found 1 current-domain work email signal for Riley Erickson. Compare company email patterns before reaching out.

Profile bio

About Riley Erickson

Mechanical Design Engineer offering a wealth of expertise in SolidWorks, Design for Manufacturing (DFM), prototyping, and 3D Printing. With a background spanning the aerospace and semiconductor industries, I have demonstrated a skill for translating intricate technical requirements into tangible mechanical drawings implementing GD&T standards. Proven ability to work in detail-oriented and fast-paced environments. Seeking to leverage my skills and expertise to contribute to a dynamic team and drive the development of cutting-edge products.

Current workplace

Riley Erickson's current company

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Intel Corporation
Intel Corporation
Packaging R&D Engineer at Intel
(408) 765-8080
Website
Employees
10
AeroLeads page
6 roles

Riley Erickson work experience

A career timeline built from the work history available for this profile.

Packaging R&D Engineer

Current

Santa Clara, California, Us

Jun 2022 - Present

Design Engineer

Chandler, Az, Us

• In charge of maintaining a product line of pavement preservation equipment.• Continuously improving equipment components to satisfy customers and address any concerns from previous designs.• Use Solid Edge in conjunction with SAP to create new parts, BOMs, routes, and other documentation.

Oct 2021 - May 2022

Design Engineering Intern

Wallingford, Connecticut, Us

• Designed (using SolidWorks), built, and implemented a new tooling fixture that allows the company to mill smaller cable sizes than they were previously able to. • Created SolidWorks drawings with appropriate GD&T and collaborated with machine shops to order new & redesigned parts. • Worked closely with the production floor on a regular basis to reduce setup and assembly times. • Edited and improved manufacturing instructions.

May 2021 - Sep 2021

Design Engineering Intern

Rochester, New Hampshire, Us

• Played lead role in redesigning a Boeing frame holding fixture using SolidWorks, including all assembly and individual part drawings.• Mastered product realization using Discus and Excel to balloon drawings and add necessary GD&T.• Collaborated with the production floor to perform process audits on work instructions daily.

May 2020 - Aug 2020

Designer For Boane Women'S Center

• Created complete detailed building plans using Autodesk Revit.• Worked collaboratively with project manager to create designs that met client goals.

Sep 2019 - Sep 2019

Quality Engineering Intern

Ogden, Ut, Us

• Performed quality checks and FAIs on aerospace and gas industry machined parts.• Used Bridge Coordinate-Measuring Machine (CMM) for quality assurance daily.• Collected and sent out tooling for required monthly recertification.

May 2019 - Aug 2019
Team & coworkers

Colleagues at Intel Corporation

Other employees you can reach at intel.com. View company contacts for 10 employees →

2 education records

Riley Erickson education

Bachelor'S Degree, Design Engineering Technology

Weber State University

Bachelor'S Degree, Mechanical Engineering

University Of Nevada-Las Vegas
FAQ

Frequently asked questions about Riley Erickson

Quick answers generated from the profile data available on this page.

What company does Riley Erickson work for?

Riley Erickson works for Intel Corporation.

What is Riley Erickson's role at Intel Corporation?

Riley Erickson is listed as Packaging R&D Engineer at Intel at Intel Corporation.

What is Riley Erickson's email address?

AeroLeads has found 1 work email signal at @intel.com for Riley Erickson at Intel Corporation.

Where is Riley Erickson based?

Riley Erickson is based in Greater Phoenix Area, United States while working with Intel Corporation.

What companies has Riley Erickson worked for?

Riley Erickson has worked for Intel Corporation, Crafco, Inc., Times Microwave Systems, Albany Engineered Composites, and No Poor Among Us.

Who are Riley Erickson's colleagues at Intel Corporation?

Riley Erickson's colleagues at Intel Corporation include Chakradhar Mella, Baljot Dhillon, Aji Rofiki, Abhaya Shetty, and D Star.

How can I contact Riley Erickson?

You can use AeroLeads to view verified contact signals for Riley Erickson at Intel Corporation, including work email, phone, and LinkedIn data when available.

What schools did Riley Erickson attend?

Riley Erickson holds Bachelor'S Degree, Design Engineering Technology from Weber State University.

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