Engineer
CurrentThin film characterization, metrology (composition, thickness, magnetic properties, resistivity, thin film stress, contamination, defects), X-ray Fluorescence systems calibration, R&D, process&tool qualification, failure analysis, resolving daily scrap Issues, statistical process control, statistical data analysis, DOE, R&R Gauge Capability analysis, New product integration, numerical simulation of thin film electrodeposition and magnetization processes, key person for tool capital request in metrology.