1.Probe liaison within Taiwan to understand manufacturing site requirements related to Probe processes and equipment. 2.Gather requirements from internal site customers (Test, Product & Quality Engineering) in support of Probe process, equipment and data systems capability enhancements. 3.Advocate in Taiwan as interface to vendors local representatives in the integration and deployment of Probe equipment. 4.Deploy FOAK (First of a Kind) equipment and process capabilities through the evaluation of Wafer Probers, Testers and Probe Card technology. 5.Participate in Tool Of Record (TOR) and Manufacturing Tool Evaluation Program (MTEP) programs requirements to ensure Capital business process runs effectively (monthly cycles as well as quarterly Model of Record (MOR) cycles). 6.Initiate and or chair meetings with global Probe sites in support of probe processes for your domain. 7.Collaborate with global teams in the Probe network to establish and implement BKM Global Probe Processes. 8.Report, investigate first-of-a-kind manufacturing issues and develop methods or processes to close gaps. 9.Drive adoption of BKM’s and foster alignment between Taiwan and Japan HVM sites.

1.The new project develop of management, I’m a project leader to make everything smooth  2.Testing machine development for 93K probe card  3.Expand the wafer prober application, ex: probe head life time, run in and review probe mark…4.Leading the simulation of mechanism team, VPC P/H new design, verification and introduction of new needle material characteristics (ex: CCC, force, CR…)  5.Human resources Deployment, cooperation supplier evaluation, research and development of probe card for new technology...etc.

1. Expand the company's PCB business, to discuss the new case, the conversion of tester platform.2. Responsible for customer contact window between schematic & layout designer, to clear understanding of customer needs, and clearly indicated to the designer to make changes.3. To help customers review ATE Load board or probe card layout.

1.Develop the Probecard/Loadboard for mass production2.Survey tester, handler, socket and load board3.Debug the Testing H/W and S/W issue4.Increase the test fault coverage to reduce the RMA DPPM5.Support the sub-con ramp up for mass production, including the H/W and Test program6.Prepare the customer engineering samples7.Support Assembly reliability qualification test8.Test time reduction and conversion of dual site for test cost saving

1.New production development2.In-charge project budget management and cost control 3.Communicate with other departments4.Training new employees5.Probe Card, Prober, tester, Laser machine, operator and engineer management

1.To monitor the regularity of system during the running2.Verification new program3.Quality control4.Analysis abnormal hold lots5.M/C, Laser Repair qualifier for production