Ryan Mcghee Email & Phone Number

After Texas Instruments acquisition of Micron Lehi, UT facility, my role and job responsibilities expanded. Along with processes involving striping and cleaning test wafers, ownership of the processes re-applying the proper films, prior to being used as a qual/monitor, was added. I started TI’s first network wide TW process development & sharing forum to.

After Micron acquisition of IM Flash Technology, I continued in my role as Engineering manager for the NPW/TW Department. Led and helped create TW recycle processes that were best in class at Micron for key metrics; best in class quality by 4x, best in class output by 35%, best in class cost per wafer by 45%. Continued to expand departmental responsibility.

Responsible for managing/developing supervisors, engineers, and technicians. Department responsibilities included all non-production-based wafers including test wafers (TW), engineering wafers, and topography (TOPO) wafers. Developing metrics to monitor all aspects of the department. Setting expectations for supporting all process areas, optimizing the.

Driving experiments to develop/improve the wafer manufacturing process used in microprocessor and logic designs including extensive experience with DOE’s to improve device capability/functionality. Monitor/analyze process improvements aligned with all critical vectors (cost, velocity, quality). Leading engineering teams to address complex integrated.

Led numerous projects involving cross-departmental teams including chemical changes/end-of-life & chemical usage reduction for both wet etch & photolithography departments, resulting in over $100 of savings per wafer and over 20 hrs of cycle-time by combining/eliminating operations. Also led multiple LEAN manufacturing events, including kaizen events.

Managing a group of 4-8 engineers. Ownership responsibilities included all FOUP/FOSB types (cleaning, maintenance, & allocation); all wafer transfer/sorting tools, Si starts room activities, and scrap processes. Leveraging direct engineering reports to maintain cadence on critical projects and support factory objectives. Driving a safety-first culture in.

Responsible for in-line defect and cycle-time performance of a particular section of the process line. Activities included setting expectations for area representatives to address both tactical and strategic objectives. Reporting out to all levels of factory management on segment performance. During tenor as IST leader the team improved defect performance.

Tool ownership of multiple processes through start-up, ramp, and high-volume sustaining activities. Direct ownership of both single spin and batch processing tools. Led multiple teams through structured Model Based Problem Solving (MBPS) methodology to improve key metrics (safety, cost, velocity, quality). Results included a 12% improvement in.

Back-up lead engineer for a group of 12-15 engineers and technicians. Directing daily sustaining work, delivering module metrics for team, leading sub-teams of engineers on quality, defect, and utilization improvements. Extensive project work (both individual and as a team leader for quality teams) to improve existing methods and procedures to reduce scrap.

Operates manufacturing equipment in the Thin Films Department for one of the leading manufacturers of computer semiconductors (Novellus machines).