Electrical Engineer
CurrentGaN-based HEMTs and microLEDs - Design and build test vehicles to evaluate new processing schemes and materials for GaN-based devices - Qualification and ownership of semi-automated 300mm microLED optical/electrical characterization toolHybrid bonding - Test vehicle layout design for 300mm wafer-to-wafer hybrid bonding - Evaluating new materials and process integration for hybrid bonding at <500 nm pitchesIC packaging - Polymer/Cu redistribution layers (RDL) for wafer level packaging - Process integration and layout design for dual damascene structuresLithography - Management of direct write lithography laboratory for coupons and wafers - Process qualification and maintenance of lithography steps on Si, SiC and GaN devices